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參數(shù)資料
| 型號： | T612-012.80M |
| 廠商： | CONNOR WINFIELD CORP |
| 元件分類： | XO, clock |
| 英文描述： | TCXO, CLOCK, 12.8 MHz, LVCMOS OUTPUT |
| 封裝： | ROHS COMPLIANT, CERAMIC PACKAGE-10 |
| 文件頁數(shù)： | 4/4頁 |
| 文件大?。?/td> | 392K |
| 代理商： | T612-012.80M |
Table 14.0
Package
Ceramic Surface Mount Package.
2111 Comprehensive Drive
Aurora, Illinois 60505
Phone: 630-851-4722
Fax: 630-851-5040
www.conwin.com
120
°C
150
°C
180
°C
260
°C
0
220
°C
360 Sec.Max.
120 S
10 S
60 S
Time
Temperature
260°C
90%
50%
10%
200 mV/Div
0
Design Recommendations
1
Tape andReelSpecifications
OSC
TOP LAYER
GROUND LAYER
BOTTOM LAYER
Output
Buffer
50 Ohm Trace
Without
Vias
.
Model T504-019.44MHz
Typical Phase Noise
Solder Profile
LVCMOS Output Waveform
Clipped Sinewave Output Waveform
Package Characteristics
Environmental Characteristics
Vibration:
Vibration per Mil Std 883E Method 2007.3 Test Condition A
Shock:
Mechanical Shock per Mil Std 883E Method 2002.4 Test Condition B.
Soldering:
SMD product suitable for Convection Reflow soldering. Peak
temperature 260
C. Maximumtime above 220
C, 60 seconds.
Solderability
Solderability per Mil Std 883E Method 2003
Table 15.0
Suggested Pad Layout
Vcc, should have
a large copper
area for reduced
inductance.
Connect a 0.01uF
bypass capacitor
<0.1”(2.54mm)
from the pad.
Ground,
should have
a large copper
area for reduced
inductance.
0.010”(0.254mm)
Recommended
clearance
inductance
for internal
copper flood.
Top View
1
3
4
5
6
8
9
10
Buffer
Ground
50 Ohm trace
<1”by design
Vcc
Ground
Top View
(50.215
(00.037
(10.051
(10.051
0.295
(7.49mm)
(00.030
Keep OutArea
TopView
1
Dimensional Tolerance:
±.005 (.127mm)
±.02 (.508mm)
Specifications subject to change without notice. All dimensions in inches. Copyright 2007 The Connor-Winfield Corporation
US Headquarters:
630-851-4722
European Headquarters:
+353-61-472221
Bulletin
Page
Revision
Date
Tx176
4 of 4
06
30 Aug 2007
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參數(shù)描述 |
|---|---|
| T612-019.44M | 制造商:CONNOR-WINFIELD 制造商全稱:Connor-Winfield Corporation 功能描述:Telecom Performance TCXO / VCTCXO |
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