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參數(shù)資料
| 型號(hào)： | SW-313-TB |
| 英文描述： | Matched GaAs SPDT Switch, DC-3.0 GHz with TTL/CMOS Control Input |
| 中文描述： | 匹配砷化鎵單刀雙擲開(kāi)關(guān)的DC - 3.0 GHz的具有TTL / CMOS控制輸入 |
| 文件頁(yè)數(shù)： | 1/4頁(yè) |
| 文件大?。?/td> | 151K |
| 代理商： | SW-313-TB |
Matched GaAs SPDT Switch,
DC-3.0 GHz with TTL/CMOS Control Input
SW-313-PIN
M/A-COM Inc. and its affiliates reserve the right to make changes to the
product(s) or information contained herein without notice. M/A-COM makes
no warranty, representation or guarantee regarding the suitability of its
products for any particular purpose, nor does M/A-COM assume any liability
whatsoever arising out of the use or application of any product(s) or
information.
North America
Tel: 800.366.2266 / Fax: 978.366.2266
Europe
Tel: 44.1908.574.200 / Fax: 44.1908.574.300
Asia/Pacific
Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macom.com
for additional data sheets and product information.
V5
1
RoHS
Compliant
Features
Integral TTL Driver
Low DC Power Consumption
Fast Switching Speed: 7 ns Typical
Surface Mount Package
50 Ohm Nominal Impedance
MIL-STD-883 Screening Available
Lead-Free CR-9 Package
260°C Reflow Compatible
Description
M/A-COM’s SW-313-PIN is a GaAs FET SPDT ab-
sorptive switch with integral silicon ASIC driver.
Packaged in a 16-lead ceramic surface mount pack-
age, this device offers excellent performance and
repeatability from DC to 3 GHz while maintaining low
power consumption. The SW-313-PIN is ideally
suited for use where fast speed, low power con-
sumption and broadband applications are required.
MIL-STD-883 screening available.
Ordering Information
Part Number
Package
SW-313-PIN
Bulk Packaging
SW-313-TB
Sample Test Board
Note: Reference Application Note M513 for reel size
information.
Note: Die quantity varies.
Functional Block Diagram
Pin Configuration
Pin No.
Function
Pin No.
Function
1
Vee
9
RFC
2
GND
10
GND
3
GND
11
GND
4
GND
12
RF1
5
RF2
13
GND
6
GND
14
GND
7
GND
15
Vcc
8
GND
16
C1
* Restrictions on Hazardous Substances, European Union Directive 2002/95/EC.
The metal bottom of the case must be connected to RF and DC
ground.
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