參數(shù)資料
型號: STR751FR0
廠商: 意法半導(dǎo)體
元件分類: ADC
英文描述: Zener Diode; Application: General; Pd (mW): 400; Vz (V): 29.02 to 30.51; Condition Iz at Vz (mA): 5; C (pF) max: -; Condition VR at C (V):   ESD (kV) min: -; Package: MHD
中文描述: 的ARM7TDMI - S⑩32位微控制器的閃存,新措施,3性病16位定時器,PWM定時器,快速的10位ADC和I2C,UART的,過磷酸鈣,USB和CAN
文件頁數(shù): 77/84頁
文件大?。?/td> 997K
代理商: STR751FR0
STR750Fxx STR751Fxx STR752Fxx STR755Fxx
Package characteristics
79/84
6.2
Thermal characteristics
The maximum chip junction temperature (TJmax) must never exceed the values given in
Table 10: General operating conditions on page 34.
The maximum chip-junction temperature, TJmax, in degrees Celsius, may be calculated
using the following equation:
TJmax = TAmax + (PDmax x ΘJA)
Where:
–TAmax is the maximum Ambient Temperature in °C,
ΘJA is the Package Junction-to-Ambient Thermal Resistance, in ° C/W,
–PDmax is the sum of PINTmax and PI/Omax (PDmax = PINTmax + PI/Omax),
–PINTmax is the product of IDD and VDD, expressed in Watts. This is the maximum
chip internal power.
–PI/Omax represents the maximum Power Dissipation on Output Pins.
Where:
PI/Omax = Σ (VOL*IOL) + Σ((VDD-VOH)*IOH),
taking into account the actual VOL / IOL and VOH / IOH of the I/Os at low and high
level in the application.
6.2.1
Reference document
JESD51-2 Integrated Circuits Thermal Test Method Environment Conditions - Natural
Convection (Still Air). Available from www.jedec.org
Table 48.
Thermal characteristics(1)
1.
Thermal resistances are based on JEDEC JESD51-2 with 4-layer PCB in a natural convection
environment.
Symbol
Parameter
Value
Unit
ΘJA
Thermal Resistance Junction-Ambient
LQFP 100 - 14 x 14 mm / 0.5 mm pitch
46
°C/W
ΘJA
Thermal Resistance Junction-Ambient
LQFP 64 - 10 x 10 mm / 0.5 mm pitch
45
°C/W
ΘJA
Thermal Resistance Junction-Ambient
LFBGA 64 - 8 x 8 x 1.7mm
58
°C/W
ΘJA
Thermal Resistance Junction-Ambient
LFBGA 100 - 10 x 10 x 1.7mm
41
°C/W
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