參數(shù)資料
型號: STPCI2HEYI
廠商: STMICROELECTRONICS
元件分類: 外設(shè)及接口
英文描述: MULTIFUNCTION PERIPHERAL, PBGA516
封裝: PLASTIC, BGA-516
文件頁數(shù): 5/109頁
文件大?。?/td> 2430K
代理商: STPCI2HEYI
STPC ATLAS
102/109
Issue 1.1 - March 23, 2004
As the PCB acts as a heat sink, the layout of top
and ground layers must be done with care to
maximize the board surface dissipating the heat.
The only limitation is the risk of losing routing
channels. Figure 6-36 and Figure 6-37 show a
routing with a good thermal dissipation thanks to
an optimized placement of power and signal vias.
The ground plane should be on bottom layer for
the best heat spreading (thicker layer than internal
ones) and dissipation (direct contact with air). .
Figure 6-36. Layout for Good Thermal Dissipation - top layer
1
A
3.3V ball
2.5V ball (Core / PLLs)
Via
STPC ball
GND ball
Not Connected ball
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