- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄383844 > STPCD0112BTC3 32-Bit Microprocessor PDF資料下載
參數(shù)資料
| 型號： | STPCD0112BTC3 |
| 元件分類： | 32位微控制器 |
| 英文描述： | 32-Bit Microprocessor |
| 中文描述： | 32位微處理器 |
| 文件頁數(shù)： | 53/61頁 |
| 文件大?。?/td> | 1007K |
| 代理商： | STPCD0112BTC3 |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁第29頁第30頁第31頁第32頁第33頁第34頁第35頁第36頁第37頁第38頁第39頁第40頁第41頁第42頁第43頁第44頁第45頁第46頁第47頁第48頁第49頁第50頁第51頁第52頁當前第53頁第54頁第55頁第56頁第57頁第58頁第59頁第60頁第61頁
BOARD LAYOUT
Issue 2.2 - October 13, 2000
53/61
6. BOARD LAYOUT
6.1 THERMAL DISSIPATION
Thermal dissipation of the STPC depends mainly
on supply voltage. As a result, when the system
does not need to work at 3.3V, it may be to reduce
the voltage to 3.15V for example. This may save
few 100’s of mW.
The second area that can be concidered is un-
used interfaces and functions. Depending on the
application, some input signals can be grounded,
and some blocks not powered or shutdown. Clock
speed dynamic adjustment is also a solution that
can be used along with the integrated power man-
agement unit.
The standard way to route thermal balls to internal
ground layer implements only one via pad for each
ball pad, connected using a 8-mil wire.
With such configuration the Plastic BGA 388 pack-
age dissipates 90% of the heat through the ground
balls, and especially the central thermal balls
which are directly connected to the die, the re-
maining 10% is dissipated through the case. Add-
ing a heat sink reduces this value to 85%.
As a result, some basic rules have to be applied
when routing the STPC in order to avoid thermal
problems.
First of all, the whole ground layer acts as a heat
sink and ground balls must be directly connected
to it as illustrated in
Figure 6-1
.
If one ground layer is not enough, a second
ground plane may be added on the solder side.
Figure 6-1. Ground routing
Pad for ground ball
Thru hole to ground layer
Top Layer : Signals
Ground layer
Power layer
Bottom Layer : signals + local ground layer (if needed)
Note: For better visibility, ground balls are not all routed.
相關PDF資料 |
PDF描述 |
|---|---|
| STPCD0113BTC3 | 32-Bit Microprocessor |
| STPCI01 | STPC INDUSTRIAL / PC COMPATIBLE EMBEDED MICROPROCESSOR |
| STPCI2 | STPC ATLAS DATASHEET / X86 CORE PC COMPATIBLE SYSTEM-ON-CHIP FOR TERMINALS |
| STPCI2GDYI | PERIPHERAL (MULTIFUNCTION) CONTROLLER |
| STPCI2HDYC | PERIPHERAL (MULTIFUNCTION) CONTROLLER |
相關代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| STPCD0113BTC3 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:32-Bit Microprocessor |
| STPCD0166BTA3 | 制造商:STMICROELECTRONICS 制造商全稱:STMicroelectronics 功能描述:PC Compatible Embedded Microprocessor |
| STPCD0166BTC3 | 制造商:STMicroelectronics 功能描述:MPU STPC RISC 64-Bit 66MHz 388-Pin BGA |
| STPCD0166BTI3 | 制造商:STMICROELECTRONICS 制造商全稱:STMicroelectronics 功能描述:PC Compatible Embedded Microprocessor |
| STPCD0175BTC3 | 功能描述:微處理器 - MPU 75MHz x86 Embedded RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324 |
發(fā)布緊急采購，3分鐘左右您將得到回復。