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參數(shù)資料
| 型號： | STM915-16 |
| 廠商： | 意法半導(dǎo)體 |
| 英文描述： | RF POWER MODULE GSM MOBILE APPLICATIONS |
| 中文描述： | 射頻電源模塊的GSM移動應(yīng)用 |
| 文件頁數(shù)： | 5/7頁 |
| 文件大?。?/td> | 62K |
| 代理商： | STM915-16 |
APPLICATIONS RECOMMENDATIONS
OPERATIONLIMITS
The STM915-16 power module should never be
operated under any condition which exceeds
the Absolute Maximum Ratings presented on
this data sheet. Nor should the module be
operated continuously at any of the specified
maximum ratings. If the module is to be
operated under any condition such that it may
be subjected to one or more of the maximum
rating conditions,care must be taken to monitor
other parameters which may be affected. For
example, a combination of high V
S3
and input
overdrive
could
result
maximum output power rating; in this condition,
the output power must be maintainedbelow the
maximum rating by use of the gain control pin.
in
exceeding
the
GAIN CONTROL
The module output power should be limited to
20 watts (43 dBm). The module is designed to
be operated with V
S1
and V
S3
set to 8.0 Vdc,
V
S2
and V
S4
set to 12.5 Vdc and input power
set to 1.0 mW (0 dBm).Module gain is adjusted
by varyingV
CONTROL
.
DECOUPLING
The
bypassing internal to the module is
sufficient for the frequencyrange 90-1300 MHz.
Care
should
be
taken
decoupling for each application as the module
is capable of a wide range of operating
characteristics including ”linear” operation, in
which an important design criteria is the use of
appropriate
bypassing. For
frequencies while maintaining the electrical
specifications contained in this data sheet, use
of the decouplingnetwork shown in the ”Module
DC and Test Fixture Configuration” diagram
herein is recommended.
to
insure
proper
bypassing low
MODULEMOUNTING
To insure adequate thermal transfer from the
module to the heatsink, it is recommended that
a satisfactory thermal compound such as Dow
Corning 340, Wakefield 120-2 or equivalent be
applied between the module flange and the
heatsink.
The heatsinkmounting surface under the module
should be flat to within
±
0.05 mm (
±
0.002 inch).
The module should be mounted to the heatsink
using 3 mm (or 4-40) or equivalent screws
torqued to 5-6 kg-cm (4-6 in-lb).
The module leads are attached to the equipment
PC board using 180
°
Csolder applied to the leads
with it properly grounded soldering iron trip, not to
exceed 195
°
C, applied a minimum of 2 mm
(0.080 inch) from the body of the module for a
duration not to exceed 15 seconds per lead. It is
imperative that no other portion of the module,
other
than
the
leads,
temperatures in excess of 100
°
C (maximum
storage temperature), for any period of time, as
the plastic moulded cover, internal components
and sealing adhesives may be adverselyaffected
by such conditions.
Due to the construction techniques and the
materials
used
within
soldering of the flange heatsink or leads, is not
recommended.
be
subjected
to
the
module,
reflow
THERMAL CONSIDERATIONS
It will be necessaryto providea suitable heatsink
in
order
to
maintain
temperature at or below the maximum case
operating temperature. In a case where the
module output power will be limited to +42 dBm
(16 W) and designing for
efficiency of 35%, the power dissipated by the
module will be 29.7 watts. The heatsink must be
designed such that the thermal rise will be less
than
the
difference between the
ambient temperature at which the module will
operate
and
the
maximum
temperature of the module while dissipating 29.7
watts.
the
module
flange
the worst case
maximum
operating
case
STM915-16
5/7
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