參數(shù)資料
型號(hào): SSM2306-MINI-EVALZ
廠商: Analog Devices Inc
文件頁數(shù): 6/16頁
文件大?。?/td> 0K
描述: BOARD EVAL FOR SSM2306-MINI
設(shè)計(jì)資源: Analog Audio Input, Class-D Output with ADAU1701, SSM2306, and ADP3336 (CN0162)
標(biāo)準(zhǔn)包裝: 1
放大器類型: D 類
輸出類型: 2 通道(立體聲)
在某負(fù)載時(shí)最大輸出功率 x 通道數(shù)量: 2.4W x 2 @ 4 歐姆
電源電壓: 2.5 V ~ 5 V
工作溫度: -40°C ~ 85°C
板類型: 完全填充
已用 IC / 零件: SSM2306
已供物品:
相關(guān)產(chǎn)品: SSM2306CPZ-REEL7DKR-ND - IC AMP AUDIO 2.4W STER D 16LFCSP
SSM2306CPZ-REEL7CT-ND - IC AMP AUDIO 2.4W STER D 16LFCSP
SSM2306CPZ-REEL7TR-ND - IC AMP AUDIO 2.4W STER D 16LFCSP
SSM2306CPZ-REEL-ND - IC AMP AUDIO 2.4W STER D 16LFCSP
SSM2306CPZ-R2TR-ND - IC AMP AUDIO 2.4W STER D 16LFCSP
SSM2306
Rev. 0 | Page 14 of 16
OUTLINE DIMENSIONS
1
0.50
BSC
0.60 MAX
PIN 1
INDICATOR
1.50 REF
0.50
0.40
0.30
0.25 MIN
0.45
2.75
BSC SQ
TOP
VIEW
12° MAX
0.80 MAX
0.65 TYP
SEATING
PLANE
PIN 1
INDICATOR
0.90
0.85
0.80
0.30
0.23
0.18
0.05 MAX
0.02 NOM
0.20 REF
3.00
BSC SQ
*1.65
1.50 SQ
1.35
16
5
13
8
9
12
4
EXPOSED
PAD
(BOTTOM VIEW)
*COMPLIANT TO JEDEC STANDARDS MO-220-VEED-2
EXCEPT FOR EXPOSED PAD DIMENSION.
Figure 36. 16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
3 mm × 3 mm Body, Very Thin Quad
(CP-16-3)
Dimensions shown in millimeters
ORDERING GUIDE
Model
Temperature Range
Package Description
Package Option
Branding
SSM2306CPZ-R21
40°C to +85°C
16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
CP-16-3
A1R
SSM2306CPZ-REEL1
40°C to +85°C
16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
CP-16-3
A1R
SSM2306CPZ-REEL71
40°C to +85°C
16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
CP-16-3
A1R
1 Z = RoHS Compliant Part.
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