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參數(shù)資料
| 型號： | SSM2306-MINI-EVALZ |
| 廠商： | Analog Devices Inc |
| 文件頁數(shù)： | 5/16頁 |
| 文件大?。?/td> | 0K |
| 描述： | BOARD EVAL FOR SSM2306-MINI |
| 設(shè)計(jì)資源： | Analog Audio Input, Class-D Output with ADAU1701, SSM2306, and ADP3336 (CN0162) |
| 標(biāo)準(zhǔn)包裝： | 1 |
| 放大器類型： | D 類 |
| 輸出類型： | 2 通道（立體聲） |
| 在某負(fù)載時(shí)最大輸出功率 x 通道數(shù)量： | 2.4W x 2 @ 4 歐姆 |
| 電源電壓： | 2.5 V ~ 5 V |
| 工作溫度： | -40°C ~ 85°C |
| 板類型： | 完全填充 |
| 已用 IC / 零件： | SSM2306 |
| 已供物品： | 板 |
| 相關(guān)產(chǎn)品： | SSM2306CPZ-REEL7DKR-ND - IC AMP AUDIO 2.4W STER D 16LFCSP SSM2306CPZ-REEL7CT-ND - IC AMP AUDIO 2.4W STER D 16LFCSP SSM2306CPZ-REEL7TR-ND - IC AMP AUDIO 2.4W STER D 16LFCSP SSM2306CPZ-REEL-ND - IC AMP AUDIO 2.4W STER D 16LFCSP SSM2306CPZ-R2TR-ND - IC AMP AUDIO 2.4W STER D 16LFCSP |
SSM2306
Rev. 0 | Page 13 of 16
LAYOUT
As output power continues to increase, careful layout is needed
for proper placement of PCB traces and wires between the ampli-
fier, load, and power supply. A good practice is to use short, wide
PCB tracks to decrease voltage drops and minimize inductance.
Make track widths at least 200 mil for every inch of track length
for lowest DCR, and use 1 oz. or 2 oz. of copper PCB traces to
further reduce IR drops and inductance. Poor layout increases
voltage drops, consequently affecting efficiency. Use large traces
for the power supply inputs and amplifier outputs to minimize
losses due to parasitic trace resistance. Proper grounding guide-
lines help to improve audio performance, minimize crosstalk
between channels, and prevent switching noise from coupling
into the audio signal.
To maintain high output swing and high peak output power, the
PCB traces that connect the output pins to the load and supply
pins should be as wide as possible to maintain the minimum
trace resistances. It is also recommended to use a large area
ground plane for minimum impedances.
Good PCB layouts isolate critical analog paths from sources of
high interference; furthermore, separate high frequency circuits
(analog and digital) from low frequency ones. Properly designed
multilayer printed circuit boards can reduce EMI emission and
increase immunity to RF field by a factor of 10 or more compared
with double-sided boards. A multilayer board allows a complete
layer to be used for the ground plane, whereas the ground plane
side of a double-sided board is often disrupted with signal cross-
over. If the system has separate analog and digital ground and
power planes, the analog ground plane should be underneath
the analog power plane, and, similarly, the digital ground plane
should be underneath the digital power plane. There should be
no overlap between analog and digital ground planes or analog
and digital power planes.
INPUT CAPACITOR SELECTION
The SSM2306 does not require input coupling capacitors if the
input signal is biased from 1.0 V to VDD 1.0 V. Input capacitors
are required if the input signal is not biased within this recom-
mended input dc common-mode voltage range, if high-pass
filtering is needed (see Figure 32), or if using a single-ended
source (see Figure 33). If high-pass filtering is needed at the
input, the input capacitor together with the input resistor of the
SSM2306 form a high-pass filter whose corner frequency is
determined by the following equation:
fC = 1/(2π × RIN × CIN)
Input capacitors can have very important effects on the circuit
performance. Not using input capacitors degrades the output
offset of the amplifier as well as the PSRR performance.
PROPER POWER SUPPLY DECOUPLING
To ensure high efficiency, low total harmonic distortion (THD),
and high PSRR, proper power supply decoupling is necessary.
Noise transients on the power supply lines are short duration
voltage spikes. Although the actual switching frequency can
range from 10 kHz to 100 kHz, these spikes can contain fre-
quency components that extend into the hundreds of megahertz.
The power supply input needs to be decoupled with a good
quality, low ESL and low ESR capacitor, usually around 4.7 μF.
This capacitor bypasses low frequency noises to the ground
plane. For high frequency transients noises, use a 0.1 μF capacitor
as close as possible to the VDD pin of the device. Placing the
decoupling capacitor as close as possible to the SSM2306 helps
maintain efficiency performance.
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相關(guān)代理商/技術(shù)參數(shù) |
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| SSM2306N | 制造商:SSC 制造商全稱:Silicon Standard Corp. 功能描述:N-CHANNEL ENHANCEMENT-MODE POWER MOSFET |
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| SSM2307N | 制造商:SSC 制造商全稱:Silicon Standard Corp. 功能描述:P-CHANNEL ENHANCEMENT MODE POWER MOSFET |
| SSM2308 | 制造商:SECOS 制造商全稱:SeCoS Halbleitertechnologie GmbH 功能描述:N-Channel Enhancement Mode Power Mos.FET |
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