參數(shù)資料
型號: SPT7861SCU
廠商: SIGNAL PROCESSING TECHNOLOGIES
元件分類: ADC
英文描述: 1-CH 10-BIT SUCCESSIVE APPROXIMATION ADC, PARALLEL ACCESS, UUC28
封裝: DIE-28
文件頁數(shù): 8/8頁
文件大?。?/td> 91K
代理商: SPT7861SCU
SPT
8
2/10/98
SPT7861
PIN ASSIGNMENTS
PIN FUNCTIONS
Name
Function
AGND
Analog Ground
VRHF
Reference High Force
VRHS
Reference High Sense
VRLS
Reference Low Sense
VRLF
Reference Low Force
VCAL
Calibration Reference
VIN
Analog Input
AVDD
Analog VDD
DVDD
Digital VDD
DGND
Digital Ground
CLK
Input Clock fCLK =fs (TTL)
EN
Output Enable
D0-9
Tri-State Data Output, (D=LSB)
D10
Tri-State Output Overrange
DAV
Data Valid Output
OVDD
Digital Output Supply
OGND
Digital Output Ground
PART NUMBER
TEMPERATURE RANGE
PACKAGE TYPE
SPT7861SCS
0 to +70
°C
28L SOIC
SPT7861SCT
0 to +70
°C
32L TQFP
SPT7861SCU
+25
°C
Die*
*Please see the die specification for guaranteed electrical performance.
ORDERING INFORMATION
2
1
3
4
5
6
7
8
23
24
22
21
20
19
18
17
26
25
27
28
29
30
31
32
15
16
14
13
12
11
10
9
VRLF
VIN
AGND
VCAL
AVDD
DVDD
D7
D6
D5
OVDD
OGND
D4
D3
D2
D1
D
DA
V
CLK
DGND
DV
DD
D8
D9
D1
AGND
V
RHF
V
RHS
V
RLS
EN
AGND
VRHF
VRHS
N/C
VRLS
VRLF
VIN
AGND
VCAL
AVDD
DVDD
DGND
CLK
DAV
1
2
3
4
5
6
7
8
9
10
11
12
13
14
28
27
26
25
24
23
22
21
20
19
18
17
16
15
OGND
D5
D1
D3
D2
D
D4
OVDD
D6
D7
D8
D9
D10
EN
SOIC
TQFP
Signal Processing Technologies, Inc. reserves the right to change products and specifications without notice. Permission is hereby expressly
granted to copy this literature for informational purposes only. Copying this material for any other use is strictly prohibited.
Covered by Patent Numbers 5262779 and 5272481.
WARNING - LIFE SUPPORT APPLICATIONS POLICY - SPT products should not be used within Life Support Systems without the specific
written consent of SPT. A Life Support System is a product or system intended to support or sustain life which, if it fails, can be reasonably
expected to result in significant personal injury or death.
Signal Processing Technologies believes that ultrasonic cleaning of its products may damage the wire bonding, leading to device
failure. It is therefore not recommended, and exposure of a device to such a process will void the product warranty.
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