- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄4005 > SPC5200CVR400R2 (Freescale Semiconductor)IC MPU 32BIT 400MHZ 272-PBGA PDF資料下載
參數(shù)資料
| 型號： | SPC5200CVR400R2 |
| 廠商： | Freescale Semiconductor |
| 文件頁數(shù)： | 72/72頁 |
| 文件大小： | 0K |
| 描述： | IC MPU 32BIT 400MHZ 272-PBGA |
| 標(biāo)準(zhǔn)包裝： | 500 |
| 系列： | MPC52xx |
| 處理器類型： | 32-位 MPC52xx PowerPC |
| 速度： | 400MHz |
| 電壓： | 1.5V |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 272-BBGA |
| 供應(yīng)商設(shè)備封裝： | 272-PBGA（27x27） |
| 包裝： | 帶卷 (TR) |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁第29頁第30頁第31頁第32頁第33頁第34頁第35頁第36頁第37頁第38頁第39頁第40頁第41頁第42頁第43頁第44頁第45頁第46頁第47頁第48頁第49頁第50頁第51頁第52頁第53頁第54頁第55頁第56頁第57頁第58頁第59頁第60頁第61頁第62頁第63頁第64頁第65頁第66頁第67頁第68頁第69頁第70頁第71頁當(dāng)前第72頁
MPC5200B Data Sheet, Rev. 4
Freescale Semiconductor
9
1.1.6
Thermal Characteristics
1.1.6.1
Heat Dissipation
An estimation of the chip-junction temperature, TJ, can be obtained from the following equation:
TJ =TA+(RθJA × PD)
Eqn. 3
where:
TA = ambient temperature for the package (C)
RθJA = junction to ambient thermal resistance (C/W)
PD = power dissipation in package (W)
The junction to ambient thermal resistance is an industry standard value, which provides a quick and easy estimation of thermal
performance. Unfortunately, there are two values in common usage: the value determined on a single layer board, and the value
obtained on a board with two planes. For packages such as the PBGA, these values can be different by a factor of two. Which
value is correct depends on the power dissipated by other components on the board. The value obtained on a single layer board
is appropriate for the tightly packed printed circuit board. The value obtained on the board with the internal planes is usually
appropriate if the board has low power dissipation and the components are well separated.
Historically, the thermal resistance has frequently been expressed as the sum of a junction to case thermal resistance and a case
to ambient thermal resistance:
Table 7. Thermal Resistance Data
Rating
Board Layers
Sym
Value
Unit
Notes
SpecID
Junction to Ambient
Natural Convection
Single layer board
(1s)
RθJA
30
°C/W
(1),(2)
1 Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site
(board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and board
thermal resistance.
2 Per SEMI G38-87 and JEDEC JESD51-2 with the single layer board horizontal.
D6.1
Junction to Ambient
Natural Convection
Four layer board (2s2p)
RθJMA
22
°C/W
(1),(3)
3 Per JEDEC JESD51-6 with the board horizontal.
D6.2
Junction to Ambient (@200
ft/min)
Single layer board
(1s)
RθJMA
24
°C/W
D6.3
Junction to Ambient (@200
ft/min)
Four layer board
(2s2p)
RθJMA
19
°C/W
D6.4
Junction to Board
—
RθJB
14
°C/W
(4)
4 Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is
measured on the top surface of the board near the package.
D6.5
Junction to Case
—
RθJC
8°C/W
(5)
5 Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL
SPEC-883 Method 1012.1).
D6.6
Junction to Package Top
Natural Convection
Ψ
JT
2°C/W
(6)
6 Thermal characterization parameter indicating the temperature difference between package top and the junction
temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter
is written as Psi-JT.
D6.7
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| GMC49DTEH | CONN EDGECARD 98POS .100 EYELET |
| MPC860SRVR66D4R2 | IC MPU POWERQUICC 66MHZ 357PBGA |
| MPC860PVR66D4R2 | IC MPU POWERQUICC 66MHZ 357PBGA |
| MPC860DPVR50D4R2 | IC MPU POWERQUICC 50MHZ 357PBGA |
| MPC860DEVR50D4R2 | IC MPU POWERQUICC 50MHZ 357PBGA |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| SPC5200VVR266B | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:SDRAM/DDR Memory Controller |
| SPC5293 | 制造商:SPC Multicomp 功能描述:D Subminiature Gender Changer Convert Fr |
| SPC5299 | 制造商:Farnell / Pro-Power 功能描述:CABLE TIE INSTALLATION TOOL 制造商:pro-power 功能描述:CABLE TIE INSTALLATION TOOL; Accessory Type:Cable Tie Tool; For Use With:2.2mm to 4.8mm Cable Ties ;RoHS Compliant: NA |
| SPC5300 | 制造商:PRO POWER (FORMERLY FROM VOLTREX) 功能描述:FERRITE BEAD CYLINDRICAL 制造商:PRO POWER (FORMERLY FROM VOLTREX) 功能描述:FERRITE CORE SPLIT 13.05MM 200 OHM/10 制造商:PRO POWER (FORMERLY FROM VOLTREX) 功能描述:FERRITE CORE, SPLIT, 13.05MM, 200 OHM/10 制造商:PRO POWER (FORMERLY FROM VOLTREX) 功能描述:FERRITE CORE, SPLIT, 13.05MM, 200 OHM/100MHZ; Cable Diameter Max:13.05mm; Ferrite Mounting:Split Core; Frequency:100MHz; Frequency Range:-; Impedance:200ohm; Internal Diameter:0.52"; Package / Case:Split Ferrite Core; Series:SPC5300 ;RoHS Compliant: Yes |
| SPC5302 | 制造商:SPC Multicomp 功能描述:FERRITE CORE SPLIT 6.5MM 133OHM 制造商:SPC Multicomp 功能描述:Split Core Ferrite Bead 制造商:SPC Multicomp 功能描述:FERRITE CORE, SPLIT, 6.5MM, 133OHM 制造商:PRO POWER (FORMERLY FROM VOLTREX) 功能描述:FERRITE CORE, SPLIT, 6.5MM, 133OHM/100MHZ; Cable Diameter Max:6.5mm; Ferrite Mounting:Split Core; Frequency:100MHz; Frequency Range:-; Impedance:133ohm; Internal Diameter:0.256"; Package / Case:Split Ferrite Core; Resistance:308ohm ;RoHS Compliant: Yes |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。