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| 型號(hào)： | SP8026 |
| 英文描述： | 200V/us Integrated APC Amplifier with Gain Adjust & Differential Output |
| 中文描述： | 200V/us綜合apc的放大器增益調(diào)整 |
| 文件頁數(shù)： | 5/8頁 |
| 文件大?。?/td> | 93K |
| 代理商： | SP8026 |
5
Rev. 6/02/03
SP8024, 25, 26 200V/
μ
s Integrated APC Amplifier
Copyright 2003 Sipex Corporation
Layout and Routing Considerations
Special care must be taken when designing the
Flex or PCB for this part. The output peak
current requirement is in the order of 12.5mA
when driving 50pF of capacitive load with a
slew rate of 200V/s Therefore care must be
taken to provide low inductance, low resistance
paths for power and ground and output traces.
Supply coupling is also very important. Good
supply decoupling is important to ensure the
high frequency performance of the system by
eliminating supply lead inductance effects. The
decoupling capacitor C1 should be as close to
the part as possible. This capacitor should be
0.1
μ
F ceramic. C2 is optional to improve
decoupling and is recommended to be 1
μ
F tan-
Figure 2. Test and Evaluation PCB Layout for COB 8 Lead Package
Top
Bottom
talum. The layout of the PCB is pictured here.
Note the wide and short traces on the supply
lines.
The traces for the gain resistors R1 and R2 are
kept as short as possible to avoid excessive
parasitics. Any parasitics on these nodes will
limit the performance of the system. R1 and R2
are subminiature potentiometers in the applica-
tion. This is a single layer board done on FR4
material.
In order to minimize coupling capacitance into
the gain setting resistor nodes, it is also critical
that V
OUT
+ and V
OUT
- are routed away from the
traces associated with the gain-setting resistors.
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