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參數(shù)資料
| 型號： | SNJ544LVT162244AWD |
| 廠商： | Texas Instruments, Inc. |
| 英文描述： | 3.3-V ABT 16-BIT BUFFERS/DRIVERS WITH 3-STATE OUTPUTS |
| 中文描述： | 的3.3V ABT生根粉16位緩沖器/ 3司機態(tài)輸出 |
| 文件頁數(shù)： | 8/20頁 |
| 文件大?。?/td> | 511K |
| 代理商： | SNJ544LVT162244AWD |
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package
Type
TSSOP
Package
Drawing
DGG
Pins Package
Qty
2000 Green (RoHS &
no Sb/Br)
2000 Green (RoHS &
no Sb/Br)
1000 Green (RoHS &
no Sb/Br)
2000 Green (RoHS &
no Sb/Br)
2000 Green (RoHS &
no Sb/Br)
25
Green (RoHS &
no Sb/Br)
25
Green (RoHS &
no Sb/Br)
1000 Green (RoHS &
no Sb/Br)
1000
Eco Plan
(2)
Lead/Ball Finish
MSL Peak Temp
(3)
74LVT162244ADGGRE4
ACTIVE
48
CU NIPDAU
Level-1-260C-UNLIM
74LVT162244ADGVRE4
ACTIVE
TVSOP
DGV
48
CU NIPDAU
Level-1-260C-UNLIM
74LVT162244ADLRG4
ACTIVE
SSOP
DL
48
CU NIPDAU
Level-1-260C-UNLIM
SN74LVT162244ADGGR
ACTIVE
TSSOP
DGG
48
CU NIPDAU
Level-1-260C-UNLIM
SN74LVT162244ADGVR
ACTIVE
TVSOP
DGV
48
CU NIPDAU
Level-1-260C-UNLIM
SN74LVT162244ADL
ACTIVE
SSOP
DL
48
CU NIPDAU
Level-1-260C-UNLIM
SN74LVT162244ADLG4
ACTIVE
SSOP
DL
48
CU NIPDAU
Level-1-260C-UNLIM
SN74LVT162244ADLR
ACTIVE
SSOP
DL
48
CU NIPDAU
Level-1-260C-UNLIM
SN74LVT162244AGQLR
NRND
BGA MI
CROSTA
R JUNI
OR
BGA MI
CROSTA
R JUNI
OR
BGA MI
CROSTA
R JUNI
OR
BGA MI
CROSTA
R JUNI
OR
GQL
56
TBD
SNPB
Level-1-240C-UNLIM
SN74LVT162244AGRDR
ACTIVE
GRD
54
1000
TBD
SNPB
Level-1-240C-UNLIM
SN74LVT162244AZQLR
ACTIVE
ZQL
56
1000 Green (RoHS &
no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
SN74LVT162244AZRDR
ACTIVE
ZRD
54
1000 Green (RoHS &
no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
(1)
The marketing status values are defined as follows:
ACTIVE:
Product device recommended for new designs.
LIFEBUY:
TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND:
Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW:
Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE:
TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent
for the latest availability information and additional product content details.
TBD:
The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS):
TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt):
This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br):
TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
PACKAGE OPTION ADDENDUM
www.ti.com
30-Mar-2007
Addendum-Page 1
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