
SN54LVU04, SN74LVU04
HEX INVERTERS
SCLS185B – FEBRUARY 1993 – REVISED APRIL 1996
1
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
EPIC
(Enhanced-Performance Implanted
CMOS) 2-
μ
Process
Typical V
OLP
(Output Ground Bounce)
< 0.8 V at V
CC
, T
A
= 25
°
C
Typical V
OHV
(Output V
OH
Undershoot)
> 2 V at V
CC
, T
A
= 25
°
C
ESD Protection Exceeds 2000 V Per
MIL-STD-883C, Method 3015; Exceeds
200 V Using Machine Model (C = 200 pF,
R = 0)
Latch-Up Performance Exceeds 250 mA
Per JEDEC Standard JESD-17
Package Options Include Plastic
Small-Outline (D), Shrink Small-Outline
(DB), Thin Shrink Small-Outline (PW), and
Ceramic Flat (W) Packages, Ceramic Chip
Carriers (FK), and Ceramic (J) 300-mil DIPs
description
These hex inverters are designed for 2.7-V to
5.5-V V
CC
operation.
The ’LVU04 contain six independent inverters with
unbuffered outputs. These devices perform the
Boolean function Y = A.
The SN74LVU04 is available in TI’s shrink
small-outline package (DB), which provides the
same I/O pin count and functionality of standard
small-outline packages in less than half the
printed-circuit-board area.
The SN54LVU04 is characterized for operation over the full military temperature range of –55
°
C to 125
°
C. The
SN74LVU04 is characterized for operation from –40
°
C to 85
°
C.
FUNCTION TABLE
(each inverter)
INPUT
A
OUTPUT
Y
H
L
L
H
Copyright
1996, Texas Instruments Incorporated
UNLESS OTHERWISE NOTED this document contains PRODUCTION
DATA information current as of publication date. Products conform to
specifications per the terms of Texas Instruments standard warranty.
parameters.
EPIC is a trademark of Texas Instruments Incorporated.
1
2
3
4
5
6
7
14
13
12
11
10
9
8
1A
1Y
2A
2Y
3A
3Y
GND
V
CC
6A
6Y
5A
5Y
4A
4Y
SN54LVU04 . . . J OR W PACKAGE
SN74LVU04 . . . D, DB, OR PW PACKAGE
(TOP VIEW)
3
2 1 20 19
9 10 11 12 13
4
5
6
7
8
18
17
16
15
14
6Y
NC
5A
NC
5Y
2A
NC
2Y
NC
3A
1
1
N
4
4
V
6
3
G
N
SN54LVU04 . . . FK PACKAGE
(TOP VIEW)
NC – No internal connection
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.