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參數(shù)資料
| 型號： | SN74LV1G79YZPR |
| 廠商： | Texas Instruments, Inc. |
| 英文描述： | SINGLE POSITIVE EDGE TRIGGERED D-TYPE FLIP FLOP |
| 中文描述： | 單上升沿觸發(fā)的D型觸發(fā)器 |
| 文件頁數(shù)： | 1/15頁 |
| 文件大?。?/td> | 357K |
| 代理商： | SN74LV1G79YZPR |
SCES220N APRIL 1999 REVISED SEPTEMBER 2003
1
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
Available in the Texas Instruments
NanoStar
and NanoFree
Packages
Supports 5-V V
CC
Operation
Inputs Accept Voltages to 5.5 V
Max t
pd
of 4 ns at 3.3 V
Low Power Consumption, 10-
μ
A Max I
CC
±
24-mA Output Drive at 3.3 V
I
off
Supports Partial-Power-Down Mode
Operation
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
ESD Protection Exceeds JESD 22
2000-V Human-Body Model (A114-A)
200-V Machine Model (A115-A)
1000-V Charged-Device Model (C101)
description/ordering information
This single positive-edge-triggered D-type flip-flop is designed for 1.65-V to 5.5-V V
CC
operation.
When data at the data (D) input meets the setup time requirement, the data is transferred to the Q output on
the positive-going edge of the clock pulse. Clock triggering occurs at a voltage level and is not directly related
to the rise time of the clock pulse. Following the hold-time interval, data at the D input can be changed without
affecting the level at the output.
NanoStar
and NanoFree
package technology is a major breakthrough in IC packaging concepts, using the
die as the package.
ORDERING INFORMATION
TA
PACKAGE
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
NanoStar
WCSP (DSBGA)
0.17-mm Small Bump YEA
SN74LVC1G79YEAR
NanoFree
WCSP (DSBGA)
0.17-mm Small Bump YZA (Pb-free)
Reel of 3000
SN74LVC1G79YZAR
_ _ _CR_
NanoStar
WCSP (DSBGA)
0.23-mm Large Bump YEP
SN74LV1G79YEPR
40
°
C to 85
°
C
NanoFree
WCSP (DSBGA)
0.23-mm Large Bump YZP (Pb-free)
SN74LV1G79YZPR
SOT (SOT-23) DBV
Reel of 3000
SN74LVC1G79DBVR
C79_
Reel of 250
Reel of 3000
SN74LVC1G79DBVT
SN74LVC1G79DCKR
SOT (SC-70) DCK
CR_
Reel of 250
SN74LVC1G79DCKT
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.
YEA/YZA, YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code,
and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition
(1 = SnPb,
= Pb-free).
Copyright
2003, Texas Instruments Incorporated
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
DBV OR DCK PACKAGE
(TOP VIEW)
1
2
3
5
4
D
CLK
GND
V
CC
Q
3
2
1
4
5
GND
CLK
D
Q
V
CC
YEA, YEP, YZA, OR YZP PACKAGE
(BOTTOM VIEW)
!"#
$"%&!
#*
#!#&,
'#(
'"!
''
#-
!
+,(
&& $##(
$#!!
'"!
$# )# #
"#
$!#-
'#
!&"'#
NanoStar and NanoFree are trademarks of Texas Instruments.
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