參數(shù)資料
型號: SN74AVC2T45YEPR
廠商: Texas Instruments, Inc.
英文描述: DUAL BIT DUAL SUPPLY BUS TRANSCEIVER WITH CONFIGURABLE VOLTAGE TRANSLATION AND 3 STATE OUTPUTS
中文描述: 雙位雙電源總線收發(fā)器可配置電壓轉(zhuǎn)換和3態(tài)輸出
文件頁數(shù): 1/21頁
文件大小: 376K
代理商: SN74AVC2T45YEPR
www.ti.com
FEATURES
Available in the Texas Instruments
NanoStar and NanoFree Packages
Control Inputs V
IH
/V
IL
Levels Are Referenced
to V
CCA
Voltage
Fully Configurable Dual-Rail Design Allows
Each Port to Operate Over the Full 1.2-V to
3.6-V Power-Supply Range
I/Os Are 4.6-V Tolerant
I
off
Supports Partial-Power-Down Mode
Operation
DCT OR DCU PACKAGE
(TOP VIEW)
1
2
3
4
8
7
6
5
V
CCA
A1
A2
GND
V
CCB
B1
B2
DIR
4
3
2
1
5
6
7
8
GND
A2
A1
V
CCA
DIR
B2
B1
V
CCB
YEP OR YZP PACKAGE
(BOTTOM VIEW)
DESCRIPTION/ORDERING INFORMATION
This dual-bit noninverting bus transceiver uses two separate configurable power-supply rails. The A port is
designed to track V
CCA
. V
CCA
accepts any supply voltage from 1.2 V to 3.6 V. The B port is designed to track
V
. V
accepts any supply voltage from 1.2 V to 3.6 V. This allows for universal low-voltage bidirectional
translation between any of the 1.2-V, 1.5-V, 1.8-V, 2.5-V, and 3.3-V voltage nodes.
SN74AVC2T45
DUAL-BIT DUAL-SUPPLY BUS TRANSCEIVER
WITH CONFIGURABLE VOLTAGE TRANSLATION AND 3-STATE OUTPUTS
SCES531F–DECEMBER 2003–REVISED MAY 2005
– 500 Mbps (1.8-V to 3.3-V Translation)
– 320 Mbps (<1.8-V to 3.3-V Translation)
– 320 Mbps (Translate to 2.5 V or 1.8 V)
– 180 Mbps (Translate to 1.5 V)
– 240 Mbps (Translate to 1.2 V)
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
Max Data Rates
BBBB
BBBB
BBBB
The SN74AVC2T45 is designed for asynchronous communication between data buses. The device transmits
data from the A bus to the B bus or from the B bus to the A bus, depending on the logic level at the
direction-control (DIR) input.
The SN74AVC2T45 is designed so that the DIR input is powered by V
CCA
.
ORDERING INFORMATION
T
A
PACKAGE
(1)
ORDERABLE PART NUMBER
TOP-SIDE MARKING
(2)
NanoStar – WCSP (DSBGA)
0.23-mm Large Bump – YEP
NanoFree – WCSP (DSBGA)
0.23-mm Large Bump – YZP (Pb-free)
SSOP – DCT
VSSOP – DCU
SN74AVC2T45YEPR
Tape and reel
_ _ _TD_
SN74AVC2T45YZPR
–40
°
C to 85
°
C
Tape and reel
Tape and reel
SN74AVC2T45DCTR
SN74AVC2T45DCUR
DT2_ _ _
DT2_
(1)
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
DCT: The actual top-side marking has three additional characters that designate the year, month, and assembly/test site.
DCU: The actual top-side marking has one additional character that designates the assembly/test site.
YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb,
= Pb-free).
(2)
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoStar, NanoFree are trademarks of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright 2003–2005, Texas Instruments Incorporated
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