參數(shù)資料
型號(hào)： SN65HVD11Q
廠商： Texas Instruments, Inc.
英文描述： 3.3V RS 485 TRANSCEIVERS
中文描述： 3.3V的RS 485接口TRANSCEIVE恏巴
文件頁(yè)數(shù)： 17/20頁(yè)
文件大小： 273K
代理商： SN65HVD11Q
SLLS505F FEBRUARY 2002 REVISED NOVEMBER 2003
www.ti.com
17
THERMAL CHARACTERISTICS OF IC
PACKAGES
JA
(Junction-to-Ambient Thermal Resistance)
is
defined as the difference in junction temperature to
ambient temperature divided by the operating power.
θ
JA
is
not
a constant and is a strong function of:
the PCB design (50% variation)
altitude (20% variation)
device power (5% variation)
θ
JA
can be used to compare the thermal performance of
packages if the specific test conditions are defined and
used. Standardized testing includes specification of PCB
construction, test chamber volume, sensor locations, and
the thermal characteristics of holding fixtures.
θ
JA
is often
misused when it is used to calculate junction temperatures
for other installations.
TI uses two test PCBs as defined by JEDEC
specifications. The low-k board gives
average
in-use
condition thermal performance, and it consists of a single
copper trace layer 25 mm long and 2-oz thick. The high-k
board gives
best case
in-use condition, and it consists of
two 1-oz buried power planes with a single copper trace
layer 25 mm long and 2-oz thick. A 4% to 50% difference
in
θ
JA
can be measured between these two test cards
JC
(Junction-to-Case Thermal Resistance)
is defined
as difference in junction temperature to case divided by the
operating power. It is measured by putting the mounted
package up against a copper block cold plate to force heat
to flow from die, through the mold compound into the
copper block.
θ
JC
is a useful thermal characteristic when a heatsink is
applied to package. It is
not
a useful characteristic to
predict junction temperature because it provides
pessimistic numbers if the case temperature is measured
in a nonstandard system and junction temperatures are
backed out. It can be used with
θ
JB
in 1-dimensional
thermal simulation of a package system.
JB
(Junction-to-Board Thermal Resistance)
is defined
as the difference in the junction temperature and the PCB
temperature at the center of the package (closest to the
die) when the PCB is clamped in a cold-plate structure.
θ
JB
is only defined for the high-k test card.
θ
JB
provides an overall thermal resistance between the die
and the PCB. It includes a bit of the PCB thermal
resistance (especially for BGA’s with thermal balls) and
can be used for simple 1-dimensional network analysis of
package system (see Figure 23).
Figure 23. Thermal Resistance
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
SN65HVD11QD 功能描述:RS-485接口IC 3.3V RS485 RoHS:否 制造商:Texas Instruments 數(shù)據(jù)速率:250 Kbps 工作電源電壓:3.3 V 電源電流:750 uA 工作溫度范圍:- 40 C to + 125 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-8 封裝:Tube
SN65HVD11QDG4 功能描述:RS-485接口IC 3.3V Diff Transc RoHS:否 制造商:Texas Instruments 數(shù)據(jù)速率:250 Kbps 工作電源電壓:3.3 V 電源電流:750 uA 工作溫度范圍:- 40 C to + 125 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-8 封裝:Tube
SN65HVD11QDR 功能描述:RS-485接口IC 3.3V Differential Transceivers RoHS:否 制造商:Texas Instruments 數(shù)據(jù)速率:250 Kbps 工作電源電壓:3.3 V 電源電流:750 uA 工作溫度范圍:- 40 C to + 125 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-8 封裝:Tube
SN65HVD11QDREP 制造商:TI 制造商全稱:Texas Instruments 功能描述:3.3 V RS-485 TRANSCEIVERS
SN65HVD11QDRG4 制造商:TI 制造商全稱:Texas Instruments 功能描述:3.3-V RS-485 TRANSCEIVERS
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