
SLLS262N JULY 1997 REVISED MARCH 2004
4
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
equivalent input and output schematic diagrams
300 k
300 k
VCC
7 V
7 V
A Input
B Input
7 V
50
VCC
Input
VCC
5
7 V
Y Output
EQUIVALENT OF EACH A OR B INPUT
EQUIVALENT OF G, G, 1,2EN OR
3,4EN INPUTS
TYPICAL OF ALL OUTPUTS
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage range, V
CC
(see Note 1)
Input voltage range, V
I
(enables and output)
Input voltage range, V
I
(A or B)
Continuous total power dissipation
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds
Storage temperature range, T
stg
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTE 1: All voltages, except differential I/O bus voltages, are with respect to the network ground terminal.
0.5 V to 4 V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
0.5 V to V
CC
+ 0.5 V
0.5 V to 4 V
See Dissipation Rating Table
260 C
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
65 C to 150 C
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DISSIPATION RATING TABLE
DERATING FACTOR
ABOVE TA = 25
°
C
5.8 mW/
°
C
7.6 mW/
°
C
3.4 mW/
°
C
17.1 mW/
°
C
11.0 mW/
°
C
11.0 mW/
°
C
6.2 mW/
°
C
8.0 mW/
°
C
PACKAGE
TA
≤
25
°
C
POWER RATING
TA = 70
°
C
POWER RATING
TA = 85
°
C
POWER RATING
TA = 125
°
C
POWER RATING
D (8)
725 mW
464 mW
377 mW
—
D (16)
950 mW
608 mW
494 mW
—
DGK
DGN§
425 mW
272 mW
221 mW
—
2.14 W
1.37 W
1.11 W
—
FK
1375 mW
880 mW
715 mW
275 mW
J
1375 mW
880 mW
715 mW
275 mW
PW (16)
774 mW
496 mW
402 mW
—
W
1000 mW
640 mW
520 mW
200 mW
This is the inverse of the junction-to-ambient thermal resistance when board mounted and with no air flow.
§The PowerPAD
must be soldered to a thermal land on the printed-circuit board. See the application note
PowerPAD Thermally Enhanced
Package
(SLMA002)