參數(shù)資料
型號(hào): SN55976A2WD
廠(chǎng)商: Texas Instruments, Inc.
英文描述: Tantalum Capacitor; Capacitor Type:Solid; Voltage Rating:35VDC; Capacitor Dielectric Material:Tantalum; Capacitance:1uF; Capacitance Tolerance:+/- 10%; Package/Case:A; Series:150D; Termination:Axial Leaded RoHS Compliant: Yes
中文描述: 9通道差分收發(fā)器
文件頁(yè)數(shù): 1/28頁(yè)
文件大?。?/td> 459K
代理商: SN55976A2WD
SN75976A, SN55976A
9-CHANNEL DIFFERENTIAL TRANSCEIVER
SLLS218B – MAY 1995 – REVISED MAY 1997
1
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
Improved Speed and Package Replacement
for the SN75LBC976
Designed to Operate at up to 20 Million
Data Transfers per Second (Fast-20 SCSI)
Nine Differential Channels for the Data and
Control Paths of the Small Computer
Systems Interface (SCSI) and Intelligent
Peripheral Interface (IPI)
SN75976A Packaged in Shrink
Small-Outline Package with 25-Mil Terminal
Pitch (DL) and Thin Shrink Small-Outline
Package with 20-Mil Terminal Pitch (DGG)
SN55976A Packaged in a 56-Pin Ceramic
Flat Pack (WD)
Two Skew Limits Available
ESD Protection on Bus Terminals
Exceeds 12 kV
Low Disabled Supply Current 8 mA Typ
Thermal Shutdown Protection
Positive- and Negative-Current Limiting
Power-Up/Down Glitch Protection
description
The SN75976A is an improved replacement for
the
industry’s
first
transceiver — the SN75LBC976. The A version
offers improved switching performance, a smaller
package, and higher ESD protection. The
SN75976A is offered in two versions. The ’976A2
skew limits of 4 ns for the differential drivers and
5 ns for the differential receivers complies with the
recommended skew budget of the Fast-20 SCSI
standard for data transfer rates up to 20 million
transfers per second. The ’976A1 supports the
Fast SCSI skew budget for 10 million
transfers per second. The skew limit ensures that the propagation delay times, not only from channel-to-channel
but from device-to-device, are closely matched for the tight skew budgets associated with high-speed parallel
data buses.
9-channel
RS-485
The patented thermal enhancements made to the 56-pin shrink small-outline package (SSOP) of the SN75976
have been applied to the new, thin shrink, small-outline package (TSSOP). The TSSOP package offers even
less board area requirements than the SSOP while reducing the package height to 1 mm. This provides more
board area and allows component mounting to both sides of the printed circuit boards for low-profile,
space-restricted applications such as small form-factor hard disk drives.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Terminals 13 through 17 and 40 through 44 are
connected together to the package lead frame
and signal ground.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
GND
BSR
CRE
1A
1DE/RE
2A
2DE/RE
3A
3DE/RE
4A
4DE/RE
V
CC
GND
GND
GND
GND
GND
V
CC
5A
5DE/RE
6A
6DE/RE
7A
7DE/RE
8A
8DE/RE
9A
9DE/RE
CDE2
CDE1
CDE0
9B+
9B
8B+
8B
7B+
7B
6B+
6B
V
CC
GND
GND
GND
GND
GND
V
CC
5B+
5B
4B+
4B
3B+
3B
2B+
2B
1B+
1B
SN75976A DGG or DL
SN55976A WD
(TOP VIEW)
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
Copyright
1997, Texas Instruments Incorporated
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