
SN54LVTH540, SN74LVTH540
3.3-V ABT OCTAL BUFFERS/DRIVERS
WITH 3-STATE OUTPUTS
SCBS681E – MARCH 1997 – REVISED APRIL 1999
1
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
State-of-the-Art Advanced BiCMOS
Technology (ABT) Design for 3.3-V
Operation and Low Static-Power
Dissipation
I
off
and Power-Up 3-State Support Hot
Insertion
Bus Hold on Data Inputs Eliminates the
Need for External Pullup/Pulldown
Resistors
Support Mixed-Mode Signal Operation (5-V
Input and Output Voltages With 3.3-V V
CC
)
Support Unregulated Battery Operation
Down to 2.7 V
Typical V
OLP
(Output Ground Bounce)
< 0.8 V at V
CC
= 3.3 V, T
A
= 25
°
C
Latch-Up Performance Exceeds 500 mA Per
JESD 17
ESD Protection Exceeds 2000 V Per
MIL-STD-883, Method 3015; Exceeds 200 V
Using Machine Model (C = 200 pF, R = 0)
Package Options Include Plastic
Small-Outline (DW), Shrink Small-Outline
(DB), and Thin Shrink Small-Outline (PW)
Packages, Ceramic Chip Carriers (FK),
Ceramic Flat (W) Package, and Ceramic (J)
DIPs
description
These octal buffers/drivers are designed specifically for low-voltage (3.3-V) V
CC
operation, but with the
capability to provide a TTL interface to a 5-V system environment.
The ’LVTH540 devices are ideal for driving bus lines or buffer memory address registers. These devices feature
inputs and outputs on opposite sides of the package that facilitate printed circuit board layout.
The 3-state control gate is a 2-input AND gate with active-low inputs so that if either output-enable (OE1 or OE2)
input is high, all outputs are in the high-impedance state.
When V
CC
is between 0 and 1.5 V, the devices are in the high-impedance state during power up or power down.
However, to ensure the high-impedance state above 1.5 V, OE should be tied to V
CC
through a pullup resistor;
the minimum value of the resistor is determined by the current-sinking capability of the driver.
These devices are fully specified for hot-insertion applications using I
off
and power-up 3-state. The I
off
circuitry
disables the outputs, preventing damaging current backflow through the devices when they are powered down.
The power-up 3-state circuitry places the outputs in the high-impedance state during power up and power down,
which prevents driver conflict.
Copyright
1999, Texas Instruments Incorporated
UNLESS OTHERWISE NOTED this document contains PRODUCTION
DATA information current as of publication date. Products conform to
specifications per the terms of Texas Instruments standard warranty.
parameters.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
OE1
A1
A2
A3
A4
A5
A6
A7
A8
GND
V
CC
OE2
Y1
Y2
Y3
Y4
Y5
Y6
Y7
Y8
SN54LVTH540 . . . J OR W PACKAGE
SN74LVTH540 . . . DB, DW, OR PW PACKAGE
(TOP VIEW)
3
2
1 20 19
9 10 11 12 13
4
5
6
7
8
18
17
16
15
14
Y1
Y2
Y3
Y4
Y5
A3
A4
A5
A6
A7
SN54LVTH540 . . . FK PACKAGE
(TOP VIEW)
A
A
O
Y
Y
O
A
G
Y
V
C