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參數(shù)資料
| 型號(hào)： | SN54LVTH273J |
| 廠商： | Texas Instruments, Inc. |
| 英文描述： | Octal D-Type 3-State Noninverting Flip-Flop; Package: SOIC-20 WB; No of Pins: 20; Container: Tape and Reel; Qty per Container: 1000 |
| 中文描述： | 的3.3V ABT生根粉八路D型倒裝，沒有明確的觸發(fā)器 |
| 文件頁數(shù)： | 7/13頁 |
| 文件大?。?/td> | 315K |
| 代理商： | SN54LVTH273J |
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package
Type
SSOP
SSOP
Package
Drawing
DB
DB
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish
MSL Peak Temp
(3)
SN74LVTH273DBLE
SN74LVTH273DBR
OBSOLETE
ACTIVE
20
20
TBD
Call TI
CU NIPDAU
Call TI
Level-1-260C-UNLIM
2000 Green (RoHS &
no Sb/Br)
2000 Green (RoHS &
no Sb/Br)
25
Green (RoHS &
no Sb/Br)
25
Green (RoHS &
no Sb/Br)
2000 Green (RoHS &
no Sb/Br)
2000 Green (RoHS &
no Sb/Br)
2000 Green (RoHS &
no Sb/Br)
2000 Green (RoHS &
no Sb/Br)
70
Green (RoHS &
no Sb/Br)
70
Green (RoHS &
no Sb/Br)
SN74LVTH273DBRE4
ACTIVE
SSOP
DB
20
CU NIPDAU
Level-1-260C-UNLIM
SN74LVTH273DW
ACTIVE
SOIC
DW
20
CU NIPDAU
Level-1-260C-UNLIM
SN74LVTH273DWE4
ACTIVE
SOIC
DW
20
CU NIPDAU
Level-1-260C-UNLIM
SN74LVTH273DWR
ACTIVE
SOIC
DW
20
CU NIPDAU
Level-1-260C-UNLIM
SN74LVTH273DWRE4
ACTIVE
SOIC
DW
20
CU NIPDAU
Level-1-260C-UNLIM
SN74LVTH273NSR
ACTIVE
SO
NS
20
CU NIPDAU
Level-1-260C-UNLIM
SN74LVTH273NSRE4
ACTIVE
SO
NS
20
CU NIPDAU
Level-1-260C-UNLIM
SN74LVTH273PW
ACTIVE
TSSOP
PW
20
CU NIPDAU
Level-1-260C-UNLIM
SN74LVTH273PWE4
ACTIVE
TSSOP
PW
20
CU NIPDAU
Level-1-260C-UNLIM
SN74LVTH273PWLE
SN74LVTH273PWR
OBSOLETE
ACTIVE
TSSOP
TSSOP
PW
PW
20
20
TBD
Call TI
CU NIPDAU
Call TI
Level-1-260C-UNLIM
2000 Green (RoHS &
no Sb/Br)
2000 Green (RoHS &
no Sb/Br)
2000 Green (RoHS &
no Sb/Br)
SN74LVTH273PWRE4
ACTIVE
TSSOP
PW
20
CU NIPDAU
Level-1-260C-UNLIM
SN74LVTH273PWRG4
ACTIVE
TSSOP
PW
20
CU NIPDAU
Level-1-260C-UNLIM
(1)
The marketing status values are defined as follows:
ACTIVE:
Product device recommended for new designs.
LIFEBUY:
TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND:
Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW:
Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE:
TI has discontinued the production of the device.
(2)
for the latest availability information and additional product content details.Pb-Free (RoHS):
TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br):
TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
Eco
Plan
-
The
planned
eco-friendly
classification:
Pb-Free
(RoHS)
or
Green
(RoHS
&
no
Sb/Br)
-
please
check
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:
The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
PACKAGE OPTION ADDENDUM
www.ti.com
5-Sep-2005
Addendum-Page 1
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