
SN54LVTH245A, SN74LVTH245A
3.3-V ABT OCTAL BUS TRANSCEIVERS
WITH 3-STATE OUTPUTS
SCBS130L – MAY 1992 – REVISED JANUARY 1997
1
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
State-of-the-Art Advanced BiCMOS
Technology (ABT) Design for 3.3-V
Operation and Low-Static Power
Dissipation
High-Impedance State During Power Up
and Power Down
Support Mixed-Mode Signal Operation (5-V
Input and Output Voltages With 3.3-V V
CC
)
Support Unregulated Battery Operation
Down to 2.7 V
Typical V
OLP
(Output Ground Bounce)
< 0.8 V at V
CC
= 3.3 V, T
A
= 25
°
C
ESD Protection Exceeds 2000 V Per
MIL-STD-883, Method 3015; Exceeds 200 V
Using Machine Model (C = 200 pF, R = 0)
Latch-Up Performance Exceeds 500 mA
Per JEDEC Standard JESD-17
Bus Hold on Data Inputs Eliminates the
Need for External Pullup/Pulldown
Resistors
Power Off Disables Inputs/Outputs,
Permitting Live Insertion
Package Options Include Plastic
Small-Outline (DW), Shrink Small-Outline
(DB), and Thin Shrink Small-Outline (PW)
Packages, Ceramic Chip Carriers (FK),
Ceramic Flat (W) Packages, and Ceramic
(J) DIPs
description
These octal bus transceivers are designed specifically for low-voltage (3.3-V) V
CC
operation, but with the
capability to provide a TTL interface to a 5-V system environment.
These devices are designed for asynchronous communication between data buses. They transmit data from
the A bus to the B bus or from the B bus to the A bus, depending on the logic level at the direction-control (DIR)
input. The output-enable (OE) input can be used to disable the devices so the buses are effectively isolated.
Active bus-hold circuitry is provided to hold unused or floating data inputs at a valid logic level.
When V
CC
is between 0 and 1.5 V, the device is in the high-impedance state during power up or power down.
However, to ensure the high-impedance state above 1.5 V, OE should be tied to V
CC
through a pullup resistor;
the minimum value of the resistor is determined by the current-sinking capability of the driver.
The SN74LVTH245A is available in TI’s shrink small-outline package (DB), which provides the same I/O pin
count and functionality of standard small-outline packages in less than half the printed circuit board area.
The SN54LVTH245A is characterized for operation over the full military temperature range of –55
°
C to 125
°
C.
The SN74LVTH245A is characterized for operation from –40
°
C to 85
°
C.
Copyright
1997, Texas Instruments Incorporated
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
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2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
DIR
A1
A2
A3
A4
A5
A6
A7
A8
GND
V
CC
OE
B1
B2
B3
B4
B5
B6
B7
B8
SN54LVTH245A . . . J OR W PACKAGE
SN74LVTH245A . . . DB, DW, OR PW PACKAGE
(TOP VIEW)
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2
1 20 19
9 10 11 12 13
4
5
6
7
8
18
17
16
15
14
B1
B2
B3
B4
B5
A3
A4
A5
A6
A7
A
A
D
B
B
O
A
G
B
V
C
SN54LVTH245A . . . FK PACKAGE
(TOP VIEW)
UNLESS OTHERWISE NOTED this document contains PRODUCTION
DATA information current as of publication date. Products conform to
specifications per the terms of Texas Instruments standard warranty.
Production processing does not necessarily include testing of all
parameters.