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參數(shù)資料
| 型號： | SMJ320C31KGDB |
| 廠商： | Texas Instruments, Inc. |
| 元件分類： | 數(shù)字信號處理 |
| 英文描述： | Floating-Point Digital Signal Processor Known Good Die(DSP，速度和靈敏度可達(dá)40MFLOPS，優(yōu)化速度靠硬件實現(xiàn)) |
| 中文描述： | 浮點數(shù)字信號處理器已知良品裸片（數(shù)字信號處理器，速度和靈敏度可達(dá)40MFLOPS，優(yōu)化速度靠硬件實現(xiàn)） |
| 文件頁數(shù)： | 4/9頁 |
| 文件大?。?/td> | 152K |
| 代理商： | SMJ320C31KGDB |
TMP320C31KGDB, SMJ320C31KGDB
FLOATING-POINT DIGITAL SIGNAL PROCESSORS
KNOWN GOOD DIES
SGUS023 – APRIL 1997
4
POST OFFICE BOX 1443
HOUSTON, TEXAS 77251–1443
TMP/SMJ320C31KGD (rev 6.1) known good die pad information
Figure 2 shows the TMP/SMJ320C31KGD die-numbering format. See Table 1 for TMP/SMJ320C31KGD die
pad information.
1
33
99
67
132
100
Die Side Number 4
34
66
Die Designator
Pad Number One
(Origin)
TMS32C31EW
Die Side Number One
8051.8
μ
m
(317 mils)
Die Side Number 2
7518.4
μ
m
(296 mils)
Die Side Number Three
Figure 2. ’320C31KGD Die Numbering Format
(See Table 1)
Table 1 provides a reference for the following:
The ’C31 signal identities in relation to the pad numbers.
The ’C31 X,Y coordinates, where bond pad 1 serves as the origin (0,0).
In addition, significant specifications include:
X,Y coordinate data is in microns ( m).
Coordinate origin is at (0,0) (center of bond pad 1).
Average pitch is 202 m (7.95 mils).
The active silicon dimensions are 7889.0
μ
m
×
7353.25
μ
m (311 mils
×
289 mils).
The approximate diced silicon dimensions (active + cut scribe street) are 8051.8
μ
m
×
7518.4
μ
m
(317 mils
×
296 mils).
Bond pad dimensions are 103.50
μ
m
×
103.50
μ
m (4.07 mils
×
4.07 mils).
Center of bond pad to edge of die ranges from 170
μ
m–213
μ
m (6.7 mils–8.4 mils). The range of 43
μ
m
exists since the dicing process will result in some tolerance. Due to the consistency and precision of the
bond pad locations in reference to each other, the center of bond pad 1 was chosen as the origin.
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