參數(shù)資料
型號： SL1ICS3101U
廠商： NXP SEMICONDUCTORS
元件分類： 消費(fèi)家電
英文描述： I.CODE1 Label IC 97pF Chip Specification
中文描述： SPECIALTY CONSUMER CIRCUIT, UUC4
封裝： DIE-4
文件頁數(shù)： 10/22頁
文件大?。?/td> 373K
代理商： SL1ICS3101U
Product Specification
SL1 ICS31 01
Rev. 1.2
July 2000
Page 10 of 22
Public
7 Mechanical Wafer Specifications
For further information as described in the following chapters please refer to the following
Philips documents:
Dicing Guidelines for Thin Wafers (< 200 μm)
General Specification for 6” Wafer
In case of doubt or inconsistency with the following chapters the above mentioned specifications
are applicable.
Designation:
each wafer is laser scribed with batch and wafer number
Wafer diameter:
150 mm (6")
±
0.3 mm
Die separation lane width:
80 μm (Scribe line)
Electrical connection of substrate:
VSS
Geometrically complete dies per wafer:
approx. 7400
Orientation of dies relat. to wafer flat:
see attached cluster map
Position of test structures:
see attached cluster map
Wafer layout:
see attached cluster map
Batch size:
24 wafers
Process:
6C15 IDFW
7.1 Wafer Status
Tested, unsawn
Tested, sawn on FFC
Minimum yield per lot:
30 %
7.2 Backside Treatment
Wafers can be delivered with a thickness of 525 μm (untreated) or with 150
μ
m
±
15 μm (approx.
6 mil) and have a ground and etched backside.
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
SL1ICS3101U/L6D 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:I.CODE1 Label IC 97pF Chip Specification
SL1ICS3101U/N5D 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:I.CODE1 Label IC 97pF Chip Specification
SL1ICS3101W 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:I.CODE1 Label IC 97pF Chip Specification
SL1ICS3101W/N4D 功能描述:接口 - 專用 ICODE 1 HC FFC RoHS:否 制造商:Texas Instruments 產(chǎn)品類型:1080p60 Image Sensor Receiver 工作電源電壓:1.8 V 電源電流:89 mA 最大功率耗散: 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:BGA-59
SL1ICS3101W/N4D,00 功能描述:射頻無線雜項(xiàng) ICODE 1 HC FFC RoHS:否 制造商:Texas Instruments 工作頻率:112 kHz to 205 kHz 電源電壓-最大:3.6 V 電源電壓-最小:3 V 電源電流:8 mA 最大功率耗散: 工作溫度范圍:- 40 C to + 110 C 封裝 / 箱體:VQFN-48 封裝:Reel
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