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| 型號(hào)： | SL1ICS3101 |
| 廠商： | NXP Semiconductors N.V. |
| 英文描述： | I.CODE1 Label IC 97pF Chip Specification |
| 中文描述： | I.CODE1標(biāo)簽IC 97pF芯片規(guī)格 |
| 文件頁數(shù)： | 17/22頁 |
| 文件大?。?/td> | 373K |
| 代理商： | SL1ICS3101 |
Product Specification
SL1 ICS31 01
Rev. 1.2
July 2000
Page 17 of 22
Public
15 Inlet/Label Characterisation and Test
15.1 Characterisation of the Inlet/Label
The parameters recommended to be characterised for the inlet/label are:
Parameter
Symbol
Conditions
Threshold field strength for
UNSELECTED READ command
(standard mode)
H
TRead
UNSELECTED READ command OK
Threshold resonance frequency
f
RT
Resonance frequency @ H
TRead
No command transmitted to the inlet/label
à
Label generates no response
à
No modulation
Threshold field strength for WRITE
command
(standard mode)
H
TWrite
WRITE (and Verifying READ) command OK
For more detailed information on inlet /label characterisation please refer to Philips application note
‘ICODE Label IC, Coil Design Guide’.
15.2 Final Test of the Inlet/Label
Basic flow for production and test:
1.
Production of wafer
2.
Testing of dies on wafer
3.
Writing of serial numbers and pre-configuration
4.
Sawing of wafer
5.
Assembly of inlets/labels
6.
Final test of inlets/labels
7.
Writing of customer data
To detect damage of EEPROM cells during production of inlets/labels a final test of the
EEPROM after assembly of the inlet/label is recommended. This is necessary to achieve
lowest failure rates.
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| SL1ICS3101U | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:I.CODE1 Label IC 97pF Chip Specification |
| SL1ICS3101U/L6D | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:I.CODE1 Label IC 97pF Chip Specification |
| SL1ICS3101U/N5D | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:I.CODE1 Label IC 97pF Chip Specification |
| SL1ICS3101W | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:I.CODE1 Label IC 97pF Chip Specification |
| SL1ICS3101W/N4D | 功能描述:接口 - 專用 ICODE 1 HC FFC RoHS:否 制造商:Texas Instruments 產(chǎn)品類型:1080p60 Image Sensor Receiver 工作電源電壓:1.8 V 電源電流:89 mA 最大功率耗散: 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:BGA-59 |
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