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參數(shù)資料
| 型號： | SL1ICS3101 |
| 廠商： | NXP Semiconductors N.V. |
| 英文描述： | I.CODE1 Label IC 97pF Chip Specification |
| 中文描述： | I.CODE1標簽IC 97pF芯片規(guī)格 |
| 文件頁數(shù)： | 13/22頁 |
| 文件大?。?/td> | 373K |
| 代理商： | SL1ICS3101 |
Product Specification
SL1 ICS31 01
Rev. 1.2
July 2000
Page 13 of 22
Public
10 Packing
The packing for shipment of wafers has to protect the wafers against shock, severe impact, dust and
electrostatic discharge. The packing of unsawn wafers or sawn wafers is done according to Philips
‘General Specification for 6” Wafer’.
10.1 Storage Recommendations
Unsawn/sawn wafers should be kept in their original packing whilst in storage.
Recommended storage conditions:
Temperature:
Climate atmosphere:
Duration of storage:
15 ... 25 °C
40 ... 60 % r.h. or dried N
2
(only unsawn wafers!)
max. 6 months
Deviating requirements have to be arranged between customer and Philips Semiconductors.
10.2 Possible Forms of Delivery
10.2.1 Packing of Unsawn Wafers
Delivery form:
wafer box
10.2.2 Packing of Sawn Wafers
Delivery form:
Foil thickness:
Foil material:
Film Frame Carrier (standard Philips carrier type P7)
0.55 ... 0.85 mm
sticky foil
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| SL1ICS3101U | I.CODE1 Label IC 97pF Chip Specification |
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| SL3ICS30 | UCODE HSL |
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相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| SL1ICS3101U | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:I.CODE1 Label IC 97pF Chip Specification |
| SL1ICS3101U/L6D | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:I.CODE1 Label IC 97pF Chip Specification |
| SL1ICS3101U/N5D | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:I.CODE1 Label IC 97pF Chip Specification |
| SL1ICS3101W | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:I.CODE1 Label IC 97pF Chip Specification |
| SL1ICS3101W/N4D | 功能描述:接口 - 專用 ICODE 1 HC FFC RoHS:否 制造商:Texas Instruments 產(chǎn)品類型:1080p60 Image Sensor Receiver 工作電源電壓:1.8 V 電源電流:89 mA 最大功率耗散: 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:BGA-59 |
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