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參數(shù)資料
| 型號： | SIW3500GIG3 |
| 廠商： | RF MICRO DEVICES INC |
| 元件分類： | 通信及網(wǎng)絡(luò) |
| 英文描述： | SPECIALTY TELECOM CIRCUIT, PBGA96 |
| 封裝： | 6 X 6 MM, GREEN, VFBGA-96 |
| 文件頁數(shù)： | 20/28頁 |
| 文件大?。?/td> | 795K |
| 代理商： | SIW3500GIG3 |
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Preliminary
27 of 28
SiW3500
60 0066 R00JIrf SiW3500 UltimateBlue SoC DS
Ordering Information
Part Number1
Operational
Temperature
Range2
Package
Solder Ball/Bump
Composition
Ordering Quantity
SiW3500DIF1,
SIW3500DIF3
Industrial
Known good die3,
Green
97.7% Sn, 2.3% ± 0.5% Ag
25 pcs on cut tape
SiW3500DIF1SB,
SIW3500DIF3SB
Industrial
Known good die3,
Green
97.7% Sn, 2.3% ± 0.5% Ag
5 pcs on cut tape
SiW3500DIF1SR,
SIW3500DIF3SR
Industrial
Known good die3,
Green
97.7% Sn, 2.3% ± 0.5% Ag
100 pcs on short reel
SiW3500DIF1-T13,
SIW3500DIF3-T13
Industrial
Known good die3,
Green
97.7% Sn, 2.3% ± 0.5% Ag
2,500 on 13” reel
SIW3500GIG1,
SIW3500GIG3
Industrial
6x6, 96-pin VFBGA,
Green package
95.5% Sn, 4% Ag, 0.5% Cu
25 pcs on cut tape
SIW3500GIG1SB,
SIW3500GIG3SB
Industrial
6x6, 96-pin VFBGA,
Green package
95.5% Sn, 4% Ag, 0.5% Cu
5 pcs on cut tape
SIW3500GIG1SR,
SIW3500GIG3SR
Industrial
6x6, 96-pin VFBGA,
Green package
95.5% Sn, 4% Ag, 0.5% Cu
100 pcs on short reel
SIW3500GIG1-T13,
SIW3500GIG3-T13
Industrial
6x6, 96-pin VFBGA,
Green package
95.5% Sn, 4% Ag, 0.5% Cu
2500 on 13” reel
1. SiW3500GIG1 and SiWDIF1 contain ROM software version 2.00.00, and SiW3500GIG3 and SiWDIF3 contain ROM software version 3.00.00.
2. Industrial temperature range: -40°C to +85°C.
3. For additional technical details about known good die, refer to the RF Micro Devices Manufacturing Note for the SiW3500DIF Bumped Die.
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