
Si5311
12
Preliminary Rev. 0.6
Table 8. Minimum Jitter Tolerance in Nanoseconds* (MULTSEL[1:0] = 11,
MULTOUT = 150 to 167 MHz)
Frequency (Hz)
9.375–
10.438 MHz
Clock Input
18.75–
20.875 MHz
Clock Input
37.5–41.75 MHz
Clock Input
75–83.5 MHz
Clock Input
150-167 MHz
Clock Input
< 300
TBD
66.7
66.7
100
TBD
6.5K
TBD
18.0
36.7
66.7
TBD
65K
TBD
3.33
4.67
8.00
TBD
325K
TBD
2.67
2.67
3.33
TBD
> 1M
TBD
2.00
2.33
2.67
TBD
*Note:
Measured using sinusoidal jitter at stated Test Condition frequency.
Table 9. Absolute Maximum Ratings
Parameter
Symbol
Value
Unit
DC Supply Voltage
V
DD
V
DIG
V
DIF
–0.5 to 2.8
V
LVTTL Input Voltage
–0.3 to 3.6
V
Differential Input Voltages
–0.3 to (V
DD
+ 0.3)
±50
V
Maximum Current any output PIN
mA
Operating Junction Temperature
T
JCT
T
STG
–55 to 150
°C
Storage Temperature Range
–55 to 150
°C
Lead Temperature (soldering 10 seconds)
300
°C
ESD HBM Tolerance (100 pf, 1.5 k
)
CLKIN+, CLKIN–, REFCLK+, REFCLK–,
All other pins
—
—
1
1.5
kV
kV
Note:
Permanent device damage may occur if the above Absolute Maximum Ratings are exceeded. Functional operation
should be restricted to the conditions as specified in the operational sections of this data sheet. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
Table 10. Thermal Characteristics
Parameter
Symbol
JA
Test Condition
Value
Unit
Thermal Resistance Junction to Ambient
Still Air
38
°C/W