參數(shù)資料
型號： Si3200-X-GS
廠商： Electronic Theatre Controls, Inc.
英文描述： DUAL PROGRAMMABLE CMOS SLIC WITH LINE MONITORING
中文描述： 兩個(gè)可編程的CMOS用戶接口與在線監(jiān)測
文件頁數(shù)： 4/128頁
文件大小： 2327K
代理商： SI3200-X-GS
Si3232
4
Preliminary Rev. 0.96
1. Electrical Specifications
Table 1. Absolute Maximum Ratings and Thermal Information
1
Parameter
Symbol
Test Condition
Value
Unit
Supply Voltage, Si3200 and Si3232
High Battery Supply Voltage
2
V
DD
, V
DD1
–V
DD4
–0.5 to 6.0
V
V
BATH
Continuous
0.4 to –104
V
10 ms
0.4 to –109
Low Battery Supply Voltage, Si3200
2
V
BAT
,
V
BATL
Continuous
V
BATH
–104
V
BATH
–15
V
BATH
–35
±100
V
TIP or RING Voltage, Si3200
V
TIP
, V
RING
Continuous
Pulse < 10
μ
s
Pulse < 4
μ
s
V
V
V
TIP, RING Current, Si3200
I
TIP
, I
RING
mA
STIPAC, STIPDC, SRINGAC,
SRINGDC Current, Si3232
±20
mA
Input Current, Digital Input Pins
I
IN
V
IND
T
A
T
STG
θ
JA
Continuous
±10
mA
Digital Input Voltage
–0.3 to (
V
DD
+ 0.3)
–40 to 100
V
Operating Temperature Range
°C
Storage Temperature Range
Si3232 Thermal Resistance, Typical
3
(TQFP-64 ePad)
Si3200 Thermal Resistance, Typical
3
(SOIC-16 ePad)
–40 to 150
°C
25
°C/W
θ
JA
55
°C/W
Continuous Power Dissipation,
Si3200
4
P
D
T
A
= 85 °C, SOIC-16
1
W
Continuous Power Dissipation,
Si3232
P
D
T
A
= 85 °C, TQFP-64
1.6
W
Notes:
1.
Permanent device damage may occur if the above Absolute Maximum Ratings are exceeded. Functional operation
should be restricted to the conditions as specified in the operational sections of this data sheet. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
2.
The dv/dt of the voltage applied to the V
BAT
, V
BATH
, and V
BATL
pins must be limited to 10 V/
μ
s.
3.
The thermal resistance of an exposed pad package is assured when the recommended PCB layout guidelines are
followed correctly. The specified performance requires that the exposed pad be soldered to an exposed copper surface
of equal size and that multiple vias are added to enable heat transfer between the top-side copper surface and a large
internal copper ground plane. Refer to “AN55: Dual ProSLIC User Guide” or to the Si3232 evaluation board data
sheet for specific layout examples.
4.
On-chip thermal limiting circuitry will shut down the circuit at a junction temperature of approximately 150 °C. For
optimal reliability, operation above 140 °C junction temperature should be avoided.
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