DOCUMENT CHANGE
參數(shù)資料
型號(hào): SI3011-F-FS
廠商: Silicon Laboratories Inc
文件頁數(shù): 31/128頁
文件大?。?/td> 0K
描述: IC VOICE DAA GCI/PCM/SPI 16SOIC
標(biāo)準(zhǔn)包裝: 48
系列: ISOcap™
電源電壓: 3 V ~ 3.6 V
安裝類型: 表面貼裝
封裝/外殼: 16-SOIC(0.154",3.90mm 寬)
供應(yīng)商設(shè)備封裝: 16-SOIC N
包裝: 管件
Si3050 + Si3011/18/19
126
Rev. 1.5
DOCUMENT CHANGE LIST
Revision 1.01 to Revision 1.1
Added package thermal information in Table 1,
Added Note 10 to the transhybrid balance parameter
Removed R54 and R55 from " " on page 18.
Changed recommended DCV setting for Japan from
01 to 10 in Table 13 on page 22.
Updated initialization procedure in "5.3. Initialization"
Removed incorrect description of FDT bit in "5.8.
Updated Billing Tone and Receive Overload section.
Updated text and added description of hybrid
coefficient format in "5.28. Transhybrid Balance" on
Removed references to line-side revisions C and E.
Updated package information for 20-Pin TSSOP and
16-Pin SOIC on pages 103 and 104.
Revision 1.1 to Revision 1.2
Updated delay time between chip selects.
Corrected ACIM settings for Brazil.
Revised Step 6 with standard hexadecimal notation.
Corrected HPF pole.
Revision 1.2 to Revision 1.3
Updated Deep Sleep Total Supply Current from 1.0
to 1.3 mA typical
Updated package pictures
Removed all SPIM references (SPIM bit is never
present in any Si3050 device).
Removed SnPb package options
Minor typo corrections
Revision 1.1 to Revision 1.31
The internal System-Side Revision value (REVA[3:0]
in Register 11) has been incremented by one for
Si3050 revision E.
Revision 1.31 to Revision 1.4
Added Si3011 device specifications
Added Si3050, Si3011, Si3018, and Si3019 QFN
information
Revision 1.4 to Revision 1.5
Updated Si3050 part numbers to reflect the latest
product revision level.
Corrected Si3011 bit settings for Register 26 [7:6
and 5:4].
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