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參數(shù)資料
| 型號(hào)： | SFC05-5.WMT |
| 元件分類： | TVS二極管 - 瞬態(tài)電壓抑制 |
| 英文描述： | 200 W, UNIDIRECTIONAL, 5 ELEMENT, SILICON, TVS DIODE, MO-211BB |
| 封裝： | LEAD FREE, FLIP CHIP, MO-211, CSP-6 |
| 文件頁(yè)數(shù)： | 4/7頁(yè) |
| 文件大?。?/td> | 212K |
| 代理商： | SFC05-5.WMT |
4
2004 Semtech Corp.
www.semtech.com
PRELIMINARY
PROTECTION PRODUCTS
SFC05-5
Device Connection Options
The SFC05-5 has solder bumps located in a 3 x 2
matrix layout on the active side of the device. The
bumps are designated by the numbers 1 - 3 along the
horizontal axis and letters A - B along the vertical axis.
The lines to be protected are connected at bumps A1,
B1, A2, A3, and B3. Bump B2 is connected to ground.
All path lengths should be kept as short as possible to
minimize the effects of parasitic inductance in the
board traces.
Flip Chip TVS
Flip chip TVS devices are wafer level chip scale pack-
ages. They eliminate external plastic packages and
leads and thus result in a significant board space
savings. Manufacturing costs are minimized since they
do not require an intermediate level interconnect or
interposer layer for reliable operation. They are com-
patible with current pick and place equipment further
reducing manufacturing costs. Certain precautions
and design considerations have to be observed how-
ever for maximum solder joint reliability. These include
solder pad definition, board finish, and assembly
parameters.
Printed Circuit Board Mounting
Non-solder mask defined (NSMD) land patterns are
recommended for mounting the SFC05-5. Solder
mask defined (SMD) pads produce stress points near
the solder mask on the PCB side that can result in
solder joint cracking when exposed to extreme fatigue
conditions. The recommended pad size is 0.225 ±
0.010 mm with a solder mask opening of 0.350 ±
0.025 mm.
Grid Courtyard
The recommended grid placement courtyard is 1.3 x
1.8 mm. The grid courtyard is intended to encompass
the land pattern and the component body that is
centered in the land pattern. When placing parts on a
PCB, the highest recommended density is when one
courtyard touches another.
Applications Information
Device Schematic and Pin Configuration
Layout Example
NSMD Package Footprint
To Protected IC
To Connector
Ground
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| SFC05C-1.TC | 制造商:Semtech Corporation 功能描述: 制造商:Semtech Corporation 功能描述:350 W, BIDIRECTIONAL, SILICON, TVS DIODE |
| SFC-1 | 功能描述:I/O 連接器 SFP CAGE 1 PORT RoHS:否 制造商:Hirose Connector 產(chǎn)品:Plugs 系列:DH 端口數(shù)量: 位置/觸點(diǎn)數(shù)量:51 節(jié)距:1 mm 觸點(diǎn)電鍍: 觸點(diǎn)材料: 型式:Male 電流額定值:0.5 A 安裝風(fēng)格:Cable 端接類型:IDC 顏色: 安裝角: |
| SFC10 | 制造商:Omron Corporation 功能描述: |
| SFC-10 | 制造商:Marcom Electronic Components 功能描述:FERRITE CORE SPLIT 10.5MM 266OHM 制造商:Marcom Electronic Components 功能描述:FERRITE CORE HINGED 10.5MM 制造商:Marcom Electronic Components 功能描述:FERRITE CORE, SPLIT, 10.5MM, 266OHM/100MHZ; Cable Diameter Max:10.5mm; Ferrite Mounting:Split Core; Frequency Range:-; Impedance:266ohm; Series:SFC ;RoHS Compliant: Yes |
| SFC1015 | 制造商:SUMIDA 制造商全稱:Sumida Corporation 功能描述:EMC CHOKE COIL |
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