
AMD Geode SC2200 Processor Data Book
369
9
Electrical Specifications
Revision 5.1
9.0Electrical Specifications
This chapter provides information about:
General electrical specifications.
DC characteristics.
AC characteristics.
All voltage values in this chapter are with respect to VSS
unless otherwise noted.
9.1
General Specifications
9.1.1
Electro Static Discharge (ESD)
This device is a high performance integrated circuit and is
ESD sensitive. Handling and assembly of this device
should be performed at ESD free workstations.
Table 9-1lists the ESD ratings of the SC2200.
9.1.2
Power/Ground Connections and
Decoupling
When testing and operating the SC2200, use standard
high frequency techniques to reduce parasitic effects. For
example:
Filter the DC power leads with low-inductance decou-
pling capacitors.
Use low-impedance wiring.
Utilizing the PWR and GND pins.
9.1.3
Absolute Maximum Ratings
369 may cause permanent damage to the SC2200, reduce
device reliability, and result in premature failure, even
when there is no immediately apparent sign of failure. Pro-
longed exposure to conditions at or near the absolute max-
imum ratings may also result in reduced device life span
and reduced reliability.
Note:
The values in the following table are stress ratings
only. They do not imply that operation under other
conditions is impossible.
Table 9-1. Electro Static Discharge (ESD)
Parameter
Units
Human Body Model (HBM)
2000V ESD
Machine Model (MM)
200V ESD
Table 9-2. Absolute Maximum Ratings
Symbol
Parameter
Min
Max
Unit
Comments
TCASE
Operating case temperature
-10
110
oC
Note 1
TSTORAGE
Storage temperature
-45
125
oC
Note 2
VCC
Supply voltage
V
VMAX
Voltage on
5V tolerant balls
-0.5
6.0
V
Note 3
Others
-0.5
3.6
V
IIK
Input clamp current
-0.5
10
mA
IOK
Output clamp current
25
mA
Note 1. Power applied - no clocks.
Note 2. No bias.
Note 3. Voltage min is -0.8V with a transient voltage of 20 ns or less.
Note 4. Voltage max is 4.0V with a transient voltage of 20 ns or less.