參數(shù)資料
型號(hào)： SC16C850VIBS
廠商： NXP Semiconductors N.V.
元件分類(lèi)： 收發(fā)器
英文描述： 1.8 V single UART, 5 Mbit-s (max.) with 128-byte FIFOs, infrared (IrDA), and XScale VLIO bus interface
封裝： SC16C850VIBS<SOT617-1 (HVQFN32)|<<http://www.nxp.com/packages/SOT617-1.html<1<Always Pb-free,;SC16C850VIBS<SOT617-1 (HVQFN32)|<<http://www.nxp.com/packages/SOT617-1.html&
文件頁(yè)數(shù)： 43/48頁(yè)
文件大?。?/td> 338K
代理商： SC16C850VIBS
SC16C850V
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 5 — 19 January 2011
43 of 48
NXP Semiconductors
SC16C850V
Single UART with 128-byte FIFOs, IrDA, and XScale VLIO bus interface
12.4 Reflow soldering
Key characteristics in reflow soldering are:
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see
Figure 16
) than a SnPb process, thus
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 38
and
39
Table 38.
Package thickness (mm)
Table 39.
Package thickness (mm)
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see
Figure 16
.
SnPb eutectic process (from J-STD-020C)
Package reflow temperature (
°
C)
Volume (mm
3
)
< 350
235
220
≥
350
220
220
< 2.5
≥
2.5
Lead-free process (from J-STD-020C)
Package reflow temperature (
°
C)
Volume (mm
3
)
< 350
260
260
250
350 to 2000
260
250
245
> 2000
260
245
245
< 1.6
1.6 to 2.5
> 2.5
相關(guān)PDF資料
PDF描述
SC16C852LIB 1.8 V dual UART, 5 Mbit-s (max.) with 128-byte FIFOs, infrared (IrDA) and 16 mode or 68 mode bus interface
SC16C852LIBS 1.8 V dual UART, 5 Mbit-s (max.) with 128-byte FIFOs, infrared (IrDA) and 16 mode or 68 mode bus interface
SC16C852LIET 1.8 V dual UART, 5 Mbit-s (max.) with 128-byte FIFOs, infrared (IrDA) and 16 mode or 68 mode bus interface
SC16C852SVIET 1.8 V dual UART, 20 Mbit-s (max.) with 128-byte FIFOs, infrared (IrDA), and XScale VLIO bus interface
SC16C852VIET 1.8 V dual UART, 5 Mbit-s (max.) with 128-byte FIFOs, infrared (IrDA) and XScale VLIO bus interface
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
SC16C850VIBS,115 功能描述:UART 接口集成電路 1.8V 1 CH UART RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 數(shù)據(jù)速率:3 Mbps 電源電壓-最大:3.6 V 電源電壓-最小:2.7 V 電源電流:20 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:LQFP-48 封裝:Reel
SC16C850VIBS,128 功能描述:UART 接口集成電路 1.8V 1 CH UART 128B RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 數(shù)據(jù)速率:3 Mbps 電源電壓-最大:3.6 V 電源電壓-最小:2.7 V 電源電流:20 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:LQFP-48 封裝:Reel
SC16C850VIBS,151 功能描述:UART 接口集成電路 1.8V 1 CH UART 128B RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 數(shù)據(jù)速率:3 Mbps 電源電壓-最大:3.6 V 電源電壓-最小:2.7 V 電源電流:20 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:LQFP-48 封裝:Reel
SC16C850VIBS,157 功能描述:UART 接口集成電路 1.8V 1 CH UART 128B RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 數(shù)據(jù)速率:3 Mbps 電源電壓-最大:3.6 V 電源電壓-最小:2.7 V 電源電流:20 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:LQFP-48 封裝:Reel
SC16C850VIBS-F 功能描述:UART 接口集成電路 1.8V 1 CH UART 128B FIFO VLIO RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 數(shù)據(jù)速率:3 Mbps 電源電壓-最大:3.6 V 電源電壓-最小:2.7 V 電源電流:20 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:LQFP-48 封裝:Reel
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