參數(shù)資料
型號： SC16C2550BIN40
廠商： NXP SEMICONDUCTORS
元件分類： 微控制器/微處理器
英文描述： 5 V, 3.3 V and 2.5 V dual UART, 5 Mbit/s (max.), with 16-byte FIFOs
中文描述： 2 CHANNEL(S), 5M bps, SERIAL COMM CONTROLLER, PDIP40
封裝： 0.600 INCH, PLASTIC, MO-015, SOT129-1, DIP-40
文件頁數(shù)： 39/42頁
文件大小： 200K
代理商： SC16C2550BIN40
Philips Semiconductors
SC16C2550B
5 V, 3.3 V and 2.5 V dual UART, 5 Mbit/s (max.), with 16-byte FIFOs
Product data
Rev. 02 — 14 December 2004
39 of 42
9397 750 14449
Koninklijke Philips Electronics N.V. 2004. All rights reserved.
12.4 Package related soldering information
[1]
For more detailed information on the BGA packages refer to the (LF)BGA Application Note
(AN01026); order a copy from your Philips Semiconductors sales office.
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the
maximum temperature (with respect to time) and body size of the package, there is a risk that internal
or external package cracks may occur due to vaporization of the moisture in them (the so called
popcorn effect). For details, refer to the Drypack information in the Data Handbook IC26; Integrated
Circuit Packages; Section: Packing Methods
For SDIP packages, the longitudinal axis must be parallel to the transport direction of the
printed-circuit board.
Hot bar soldering or manual soldering is suitable for PMFP packages.
These transparent plastic packages are extremely sensitive to reflow soldering conditions and must
on no account be processed through more than one soldering cycle or subjected to infrared reflow
soldering with peak temperature exceeding 217
°
C
±
10
°
C measured in the atmosphere of the reflow
oven. The package body peak temperature must be kept as low as possible.
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom
side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with
the heatsink on the top side, the solder might be deposited on the heatsink surface.
If wave soldering is considered, then the package must be placed at a 45
°
angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it
is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than
0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
[2]
[3]
[4]
[5]
[6]
[7]
[8]
[9]
Table 25:
Mounting
Suitability of IC packages for wave, reflow and dipping soldering methods
Package
[1]
Soldering method
Wave
Through-hole
mount
SDIP, SIL
Through-hole-
surface mount
Surface mount
BGA, LBGA, LFBGA,
SQFP, SSOP-T
[5]
,
TFBGA, VFBGA
DHVQFN, HBCC, HBGA,
HLQFP, HSQFP, HSOP,
HTQFP, HTSSOP,
HVQFN, HVSON, SMS
PLCC
[7]
, SO, SOJ
LQFP, QFP, TQFP
SSOP, TSSOP, VSO,
VSSOP
Reflow
[2]
Dipping
suitable
DBS, DIP, HDIP, RDBS,
suitable
[3]
PMFP
[4]
not suitable
not
suitable
suitable
not suitable
not suitable
[6]
suitable
suitable
not recommended
[7][8]
not recommended
[9]
suitable
suitable
suitable
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PDF描述
SC16C2550IA44 Dual UART with 16 bytes of transmit and receive FIFOs and infrared (IrDA) encoder/decoder
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
SC16C2550BIN40,112 功能描述:UART 接口集成電路 16CB 2.5V-5V 2CH RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 數(shù)據(jù)速率:3 Mbps 電源電壓-最大:3.6 V 電源電壓-最小:2.7 V 電源電流:20 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:LQFP-48 封裝:Reel
SC16C2550IA44 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Dual UART with 16 bytes of transmit and receive FIFOs and infrared (IrDA) encoder/decoder
SC16C2550IA44,512 功能描述:UART 接口集成電路 16C 2.5V-5V 2CH UART 16B FIFO RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 數(shù)據(jù)速率:3 Mbps 電源電壓-最大:3.6 V 電源電壓-最小:2.7 V 電源電流:20 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:LQFP-48 封裝:Reel
SC16C2550IA44,518 功能描述:UART 接口集成電路 16C 2.5V-5V 2CH UART 16B FIFO RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 數(shù)據(jù)速率:3 Mbps 電源電壓-最大:3.6 V 電源電壓-最小:2.7 V 電源電流:20 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:LQFP-48 封裝:Reel
SC16C2550IA44,529 功能描述:UART 接口集成電路 16C 2.5V-5V 2CH UART 16B FIFO RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 數(shù)據(jù)速率:3 Mbps 電源電壓-最大:3.6 V 電源電壓-最小:2.7 V 電源電流:20 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:LQFP-48 封裝:Reel
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