參數(shù)資料
型號: SBR02M30LP
廠商: Diodes Inc.
英文描述: Super Barrier Rectifier
中文描述: 超級障礙整流器
文件頁數(shù): 1/4頁
文件大?。?/td> 272K
代理商: SBR02M30LP
SBR02M30LP
0.2A SBR
Super Barrier Rectifier
Features
Mechanical Data
Case: DFN1006-2
Case Material: Molded Plastic, “Green” Molding
compound. UL Flammability Classification Rating
94V-0
Moisture Sensitivity: Level 1 per J-STD-020C
Polarity Indicator: Cathode Dot
Terminals: Finish - NiPdAu annealed over
Copper leadframe. Solderable per MIL-STD-202,
Method 208
Marking Information: See Page 3
Ordering Information: See Page 3
Weight: 0.001 grams (Approx.)
N
Ultra Low Leakage Current
Excellent High Temperature Stability
Patented Super Barrier Rectifier Technology
Soft, Fast Switching Capability
175oC Operating Junction Temperature
Lead Free Finish, RoHS Compliant (Note 1)
“Green” Molding Compound (No Br, Sb)
Maximum Ratings
@ T
A
= 25oC unless otherwise specified
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitive load, derate current by 20%.
Characteristic
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
RMS Reverse Voltage
Average Rectified Output Current (See Figure 1)
Non-Repetitive Peak Forward Surge Current 8.3ms
Single Half Sine-Wave Superimposed on Rated Load
Maximum Thermal Resistance
Thermal Resistance Junction to Soldering (Note 2)
Thermal Resistance Junction to Ambient (Note 3)
Operating and Storage Temperature Range
Symbol
V
RRM
V
RWM
V
RM
V
R(RMS)
I
O
Value
Unit
30
V
21
0.2
V
A
I
FSM
5.0
A
R
JS
R
JA
18
263
oC/W
T
J
, T
STG
-65 to +175
oC
Electrical Characteristics
@ T
A
= 25oC unless otherwise specified
Characteristic
Symbol
Min
Typ
Max
Unit
Test Condition
Reverse Breakdown Voltage (Note 4)
V
(BR)R
30
-
-
V
I
R
= 400 μA
Forward Voltage Drop
V
F
-
0.50
0.42
0.57
0.51
0.54
0.45
0.61
0.54
V
I
F
= 0.1A, T
J
= 25oC
I
F
= 0.1A, T
J
= 150oC
I
F
= 0.2A, T
J
= 25oC
I
F
= 0.2A, T
J
= 150oC
Leakage Current (Note 4)
I
R
-
0.1
46
0.5
150
μA
V
R
= 30V, T
J
= 25oC
V
R
= 30V, T
J
= 150oC
Notes:
_________
SBR is a registered trademark of Diodes Incorporated.
1. RoHS revision 13.2.2003. High temperature solder exemption applied, see
EU Directive Annex Note 7.
2. Theoretical R
JS
calculated from the top center of the die straight down to the PCB cathode tab solder junction.
3. FR-4 PCB, 2oz. Copper, minimum recommended pad layout per http://www.diodes.com/datasheets/ap02001.pdf.
4. Short duration pulse test used to minimize self-heating effect.
SBR02M30LP Rev. 3 - 2
1 of 4
www.diodes.com
May 2007
Diodes Incorporated
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