參數(shù)資料
型號： SAB9079HS
廠商： NXP SEMICONDUCTORS
元件分類： 畫面疊加
英文描述： Circular Connector; No. of Contacts:15; Series:JT02R; Body Material:Aluminum; Connecting Termination:Crimp; Connector Shell Size:14; Circular Contact Gender:Socket; Circular Shell Style:Box Mount Receptacle; Insert Arrangement:14-15
中文描述： PICTURE-IN-PICTURE IC, PQFP128
封裝： 14 X 20 MM, 2.72 MM HEIGHT, SHRINK, PLASTIC, SOT-387-3, QFP-128
文件頁數(shù)： 46/48頁
文件大小： 183K
代理商： SAB9079HS
2000 Jan 13
46
Philips Semiconductors
Preliminary specification
Multistandard Picture-In-Picture (PIP)
controller
SAB9079HS
Suitability of surface mount IC packages for wave and reflow soldering methods
Notes
1.
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”
These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
If wave soldering is considered, then the package must be placed at a 45
°
angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
2.
3.
4.
5.
PACKAGE
SOLDERING METHOD
WAVE
REFLOW
(1)
BGA, SQFP
HLQFP, HSQFP, HSOP, HTSSOP, SMS
PLCC
(3)
, SO, SOJ
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
not suitable
not suitable
(2)
suitable
not recommended
(3)(4)
not recommended
(5)
suitable
suitable
suitable
suitable
suitable
相關(guān)PDF資料
PDF描述
SAB9080 Circular Connector; No. of Contacts:18; Series:JT02R; Body Material:Aluminum; Connecting Termination:Crimp; Connector Shell Size:14; Circular Contact Gender:Pin; Circular Shell Style:Box Mount Receptacle; Insert Arrangement:14-18
SAB9080H Circular Connector; No. of Contacts:18; Series:JT02R; Body Material:Aluminum; Connecting Termination:Crimp; Connector Shell Size:14; Circular Contact Gender:Pin; Circular Shell Style:Box Mount Receptacle; Insert Arrangement:14-18
SAB9081 Circular Connector; No. of Contacts:18; Series:JT02R; Body Material:Aluminum; Connecting Termination:Crimp; Connector Shell Size:14; Circular Contact Gender:Socket; Circular Shell Style:Box Mount Receptacle; Insert Arrangement:14-18
SAB9081H Circular Connector; No. of Contacts:18; Series:JT02R; Body Material:Aluminum; Connecting Termination:Crimp; Connector Shell Size:14; Circular Contact Gender:Socket; Circular Shell Style:Box Mount Receptacle; Insert Arrangement:14-18
SAB9082 Circular Connector; No. of Contacts:19; Series:JT02R; Body Material:Aluminum; Connecting Termination:Crimp; Connector Shell Size:14; Circular Contact Gender:Pin; Circular Shell Style:Box Mount Receptacle; Insert Arrangement:14-19
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
SAB9080 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:NTSC Picture-In-Picture PIP controller
SAB9080H 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:NTSC Picture-In-Picture PIP controller
SAB9081 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Multistandard Picture-In-Picture PIP controller
SAB9081H 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Multistandard Picture-In-Picture PIP controller
SAB9082 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:NTSC Picture-In-Picture PIP controller
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