參數(shù)資料
型號(hào): SAA5522PS
廠商: NXP Semiconductors N.V.
英文描述: Standard TV Microcontrollers with On-Screen Display(OSD)
中文描述: 微控制器與標(biāo)準(zhǔn)電視屏幕顯示(OSD)
文件頁數(shù): 2/80頁
文件大?。?/td> 340K
代理商: SAA5522PS
1999 Oct 27
2
Philips Semiconductors
Preliminary specification
Standard TV microcontrollers with
On-Screen Display (OSD)
SAA55xx
CONTENTS
1
2
3
4
5
6
6.1
6.2
7
7.1
8
8.1
8.2
8.3
8.4
8.5
8.6
9
10
10.1
10.2
10.3
11
11.1
11.2
11.3
11.4
12
12.1
12.2
12.3
12.4
13
14
14.1
15
15.1
15.2
15.3
16
16.1
17
17.1
FEATURES
GENERAL DESCRIPTION
QUICK REFERENCE DATA
ORDERING INFORMATION
BLOCK DIAGRAM
PINNING INFORMATION
Pinning
Pin description
MICROCONTROLLER
Microcontroller features
MEMORY ORGANISATION
Security bits - program and verify
RAM organisation
Data memory
SFR memory
Character set feature bits
External (auxiliary) memory
POWER-ON RESET
REDUCED POWER MODES
Idle mode
Power-down mode
Standby mode
I/O FACILITY
I/O ports
Port type
Port alternate functions
LED support
INTERRUPT SYSTEM
Interrupt enable structure
Interrupt enable priority
Interrupt vector address
Level/edge interrupt
TIMER/COUNTER
WATCHDOG TIMER
Watchdog Timer operation
PULSE WIDTH MODULATORS
PWM control
Tuning Pulse Width Modulator (TPWM)
Software ADC (SAD)
I
2
C-BUS SERIAL I/O
I
2
C-bus port selection
MEMORY INTERFACE
Memory structure
17.2
17.3
17.4
18
18.1
18.2
18.3
18.4
19
19.1
19.2
19.3
19.4
19.5
19.6
19.7
19.8
19.9
19.10
19.11
19.12
19.13
19.14
20
21
22
22.1
23
23.1
23.2
23.3
24
25
Memory mapping
Addressing memory
Page clearing
DATA CAPTURE
Data Capture Features
Broadcast service data detection
VPS acquisition
WSS acquisition
DISPLAY
Display features
Display mode
Display feature descriptions
Character and attribute coding
Screen and global controls
Screen colour
Text display control
Display positioning
Character set
Display synchronization
Video/data switch (fast blanking) polarity
Video/data switch adjustment
RGB brightness control
Contrast reduction
MEMORY MAPPED REGISTERS
LIMITING VALUES
CHARACTERISTICS
I
2
C-bus characteristics
QUALITY AND RELIABILITY
Group A
Group B
Group C
APPLICATION INFORMATION
ELECTROMAGNETIC COMPATIBILITY
(EMC) GUIDELINES
PACKAGE OUTLINE
SOLDERING
Introduction to soldering through-hole mount
packages
Soldering by dipping or by solder wave
Manual soldering
Suitability of through-hole mount IC packages
for dipping and wave soldering methods
DEFINITIONS
LIFE SUPPORT APPLICATIONS
PURCHASE OF PHILIPS I
2
C COMPONENTS
26
27
27.1
27.2
27.3
27.4
28
29
30
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