參數(shù)資料
型號(hào): SAA4994H
廠商: NXP SEMICONDUCTORS
元件分類: 消費(fèi)家電
英文描述: Field and line rate converter with noise reduction
中文描述: SPECIALTY CONSUMER CIRCUIT, PQFP160
封裝: 28 X 28 MM, 3.40 MM HEIGHT, PLASTIC, MS-022, SOT-322-2, QFP-160
文件頁(yè)數(shù): 38/40頁(yè)
文件大小: 147K
代理商: SAA4994H
2001 Nov 23
38
Philips Semiconductors
Product specification
Field and line rate converter
with noise reduction
SAA4994H
13.5
Suitability of surface mount IC packages for wave and reflow soldering methods
Notes
1.
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”
These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
If wave soldering is considered, then the package must be placed at a 45
°
angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
2.
3.
4.
5.
PACKAGE
SOLDERING METHOD
WAVE
REFLOW
(1)
BGA, HBGA, LFBGA, SQFP, TFBGA
HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, HVQFN, SMS
PLCC
(3)
, SO, SOJ
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
not suitable
not suitable
(2)
suitable
not recommended
(3)(4)
not recommended
(5)
suitable
suitable
suitable
suitable
suitable
相關(guān)PDF資料
PDF描述
SAA4998H Field and line rate converter with noise reduction and embedded memory
SAA5246 10K OHM 0.1% 1/16W CHP RES (0603) 103
SAA5246A Integrated VIP and Teletext IVT1.0
SAA5246AGP Integrated VIP and Teletext IVT1.0
SAA5246AP Integrated VIP and Teletext IVT1.0
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
SAA4995WP 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:PANorama-IC PAN-IC
SAA4996H 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Motion Adaptive Colour Plus And Control IC MACPACIC for PALplus
SAA4997H 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:VErtical Reconstruction IC VERIC for PALplus
SAA4998H 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Field and line rate converter with noise reduction and embedded memory
SAA50 制造商:Anglo Adhesives 功能描述:RS STRUCT ACRYLC ADH 50ML