- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄372102 > SA5223D (NXP SEMICONDUCTORS) Wide dynamic range AGC transimpedance amplifier 150MHz PDF資料下載
參數(shù)資料
| 型號： | SA5223D |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | 通信及網(wǎng)絡(luò) |
| 英文描述： | Wide dynamic range AGC transimpedance amplifier 150MHz |
| 中文描述： | SPECIALTY TELECOM CIRCUIT, PDSO8 |
| 封裝： | 3.90 MM, PLASTIC, MS-012AA, SOT-96-1, SOP-8 |
| 文件頁數(shù)： | 5/12頁 |
| 文件大?。?/td> | 136K |
| 代理商： | SA5223D |
Philips Semiconductors
Product specification
SA5223
Wide dynamic range AGC transimpedance amplifier(150MHz)
1995 Oct 24
5
1
2
3
4
8
7
6
5
SD00507
GND
G1
IN
V
CC
OUT
OUTB
G2
GND
PAD CENTER LOCATIONS
X(mm)
Y(mm)
GND1
-0.400
-0.400
+0.400
+0.400
+0.400
+0.400
-0.053
-0.223
-0.342
-0.046
+0.154
+0.380
IN
GND2
OUT
OUTB
V
CC
DIE SIZE
X(mm)
1.08
Y(mm)
1.32
NC
NC
NC
Figure 1. SA5223 Bonding Diagram
Die Sales Disclaimer
Due to the limitations in testing high frequency and other parameters
at the die level, and the fact that die electrical characteristics may
shift after packaging, die electrical parameters are not specified and
die are not guaranteed to meet electrical characteristics (including
temperature range) as noted in this data sheet which is intended
only to specify electrical characteristics for a packaged device.
All die are 100% functional with various parametrics tested at the
wafer level, at room temperature only (25
°
C), and are guaranteed to
be 100% functional as a result of electrical testing to the point of
wafer sawing only. Although the most modern processes are
utilized for wafer sawing and die pick and place into waffle pack
carriers, it is impossible to guarantee 100% functionality through this
process. There is no post waffle pack testing performed on
individual die.
Since Philips Semiconductors has no control of third party
procedures in the handling or packaging of die, Philips
Semiconductors assumes no liability for device functionality or
performance of the die or systems on any die sales.
Although Philips Semiconductors typically realizes a yield of 85%
after assembling die into their respective packages, with care
customers should achieve a similar yield. However, for the reasons
stated above, Philips Semiconductors cannot guarantee this or any
other yield on any die sales.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| SA5230FE | Low Voltage Operational Amplifier |
| SA5230 | Low voltage operational amplifier(低壓運算放大器) |
| SA5230D | Low Voltage Operational Amplifier |
| SA5230N | Low Voltage Operational Amplifier |
| SA5232 | Matched dual high-performance low-voltage operational amplifier |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| SA5224 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:FDDI fiber optic postamplifier |
| SA5224D | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:FDDI fiber optic postamplifier |
| SA5225 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Fiber optic postamplifier |
| SA5225D | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Fiber optic postamplifier |
| SA5230 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Low voltage operational amplifier |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。