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參數(shù)資料
| 型號： | SA5212AD/01,112 |
| 廠商： | NXP Semiconductors |
| 文件頁數(shù)： | 8/20頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC TRANSIMP AMP 140MHZ 8-SOIC |
| 標準包裝： | 2,000 |
| 放大器類型： | 轉(zhuǎn)阻 |
| 電路數(shù)： | 1 |
| 輸出類型： | 差分 |
| -3db帶寬： | 140MHz |
| 電流 - 電源： | 26mA |
| 電流 - 輸出 / 通道： | 4mA |
| 電壓 - 電源，單路/雙路(±)： | 4.5 V ~ 5.5 V |
| 工作溫度： | -40°C ~ 85°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 8-SOIC（0.154"，3.90mm 寬） |
| 供應(yīng)商設(shè)備封裝： | 8-SO |
| 包裝： | 管件 |
| 其它名稱： | 935275245112 SA5212AD/01 SA5212AD/01-ND |
Philips Semiconductors
Product specification
SA5212A
Transimpedance amplifier (140MHz)
1998 Oct 07
16
1
2
3
4
5
6
7
8
GND1
OUT+
GND2
OUT–
GND2
IIN
VCC
ECN No.: 99918
1990 Jul 5
SD00489
Figure 18. SA5212A Bonding Diagram
Die Sales Disclaimer
Due to the limitations in testing high frequency and other parameters
at the die level, and the fact that die electrical characteristics may
shift after packaging, die electrical parameters are not specified and
die are not guaranteed to meet electrical characteristics (including
temperature range) as noted in this data sheet which is intended
only to specify electrical characteristics for a packaged device.
All die are 100% functional with various parametrics tested at the
wafer level, at room temperature only (25
°C), and are guaranteed to
be 100% functional as a result of electrical testing to the point of
wafer sawing only. Although the most modern processes are
utilized for wafer sawing and die pick and place into waffle pack
carriers, it is impossible to guarantee 100% functionality through this
process. There is no post waffle pack testing performed on
individual die.
Since Philips Semiconductors has no control of third party
procedures in the handling or packaging of die, Philips
Semiconductors assumes no liability for device functionality or
performance of the die or systems on any die sales.
Although Philips Semiconductors typically realizes a yield of 85%
after assembling die into their respective packages, with care
customers should achieve a similar yield. However, for the reasons
stated above, Philips Semiconductors cannot guarantee this or any
other yield on any die sales.
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