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參數資料
| 型號： | S75WS256NDGBAWLK3 |
| 廠商： | Spansion Inc. |
| 英文描述： | Stacked Multi-Chip Product (MCP) |
| 中文描述： | 堆疊式多芯片產品（MCP） |
| 文件頁數： | 8/15頁 |
| 文件大?。?/td> | 235K |
| 代理商： | S75WS256NDGBAWLK3 |
6
S75WS-N Based MCPs
S75WS-N_02_A2 October 6, 2005
P r e l i m i n a r y
4 MCP Block Diagram
Notes:
1.
MRS is only present in RAM Type 4.
2.
CE#f1, CE#f2, and CE#f3 are the chip enable pins for the first, second and third Flash devices, respectively.
Figure 4.1 MCP Block Diagram 1
A0-A22
A0-A22
A23
A23
RDY
RDY
DQ0-DQ15
CLK
AVD#
F1-CE#
OE#
F-RST#
F-ACC
F1-WP#
F-WE#
CLK
AVD#
CE#
OE#
RESET#
ACC
WP#
WE#
VSS
VSS
VCC
VCCQ
F-VCC
F-VCCQ
A0-A22
WAIT#
CLK
AVD#
CE#
OE#
R-CE#
R-LB#
R-UB#
LB#
UB#
WE#
MRS#
R-MRS#
VSS
VCC
VCCQ
R-VCC
R-VCCQ
A0-A22
A23
RDY
CLK
AVD#
CE#
OE#
RESET#
ACC
WP#
WE#
F2-CE#
FD-WP#
VSS
VCC
VCCQ
A0-A22
A23
RDY
CLK
AVD#
CE#
OE#
RESET#
ACC
WP#
WE#
F3-CE#
VSS
VCC
VCCQ
DQ0-DQ15
DQ0-DQ15
DQ0-DQ15
DQ0-DQ15
WS256N
Flash
Memory
128Mb
Memory
WS256N
Flash
Memory
WS256N
Flash
Memory
v
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| S75WS256NDGBAWNH0 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
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| S75WS256NDGBAWNJ2 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
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