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參數(shù)資料
| 型號： | S75WS256NDGBAWNK3 |
| 廠商： | Spansion Inc. |
| 英文描述： | Stacked Multi-Chip Product (MCP) |
| 中文描述： | 堆疊式多芯片產(chǎn)品（MCP） |
| 文件頁數(shù)： | 1/15頁 |
| 文件大?。?/td> | 235K |
| 代理商： | S75WS256NDGBAWNK3 |
Publication Number
S75WS-N_02
Revision
A
Amendment
2
Issue Date
October 6, 2005
S75WS-N Based MCPs
Stacked Multi-Chip Product (MCP)
256 Megabit (16M x 16-bit) CMOS 1.8 Volt-only
Simultaneous Read/Write, Burst-mode Flash Memory
with 128 Mb (8M x 16-Bit) RAM Type 4 and
512 Mb (32M x 16-bit) Data Flash or 1 Gb ORNAND Flash
Data Sheet
PRELIMINARY
Notice to R eaders:
This document indicates states the current technical
specifications regarding the S pansion product(s) described herein. The
Preliminary status of this document indicates that a product qualification has
been completed, and that initial production has begun. Due to the phases of
the manufacturing process that require maintaining efficiency and quality, this
document may be revised by subsequent versions or modifications due to
changes in technical specifications.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| S75WS256NDGBAWSK0 | Stacked Multi-Chip Product (MCP) |
| S75WS256NDGBAWSK2 | Stacked Multi-Chip Product (MCP) |
| S75WS256NDGBFWSK0 | Stacked Multi-Chip Product (MCP) |
| S75WS256NDGBFWSK2 | Stacked Multi-Chip Product (MCP) |
| S75WS256NDGBFWSK3 | Stacked Multi-Chip Product (MCP) |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| S75WS256NDGBAWSH0 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
| S75WS256NDGBAWSH2 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
| S75WS256NDGBAWSH3 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
| S75WS256NDGBAWSJ0 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
| S75WS256NDGBAWSJ2 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
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