| 型號: | S75WS256NDFBFWLK2 | 
| 廠商: | SPANSION LLC | 
| 元件分類: | 存儲器 | 
| 英文描述: | Stacked Multi-Chip Product (MCP) | 
| 中文描述: | SPECIALTY MEMORY CIRCUIT, PBGA84 | 
| 封裝: | 9 X 12 MM, 1.40 MM HEIGHT, LEAD FREE, FBGA-84 | 
| 文件頁數(shù): | 14/15頁 | 
| 文件大?。?/td> | 235K | 
| 代理商: | S75WS256NDFBFWLK2 | 

| 相關(guān)PDF資料 | PDF描述 | 
|---|---|
| S75WS256NDFBFWLK3 | Stacked Multi-Chip Product (MCP) | 
| S75WS256NDFBFWNH0 | Stacked Multi-Chip Product (MCP) | 
| S75WS256NDFBFWNH2 | Stacked Multi-Chip Product (MCP) | 
| S75WS256NDFBFWNH3 | Stacked Multi-Chip Product (MCP) | 
| S75WS256NDFBFWNJ0 | Stacked Multi-Chip Product (MCP) | 
| 相關(guān)代理商/技術(shù)參數(shù) | 參數(shù)描述 | 
|---|---|
| S75WS256NDFBFWLK3 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) | 
| S75WS256NDFBFWMA | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) | 
| S75WS256NDFBFWMB | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) | 
| S75WS256NDFBFWNH0 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) | 
| S75WS256NDFBFWNH2 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |