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參數(shù)資料
| 型號(hào)： | S75WS256NDFBFWLK2 |
| 廠商： | SPANSION LLC |
| 元件分類： | 存儲(chǔ)器 |
| 英文描述： | Stacked Multi-Chip Product (MCP) |
| 中文描述： | SPECIALTY MEMORY CIRCUIT, PBGA84 |
| 封裝： | 9 X 12 MM, 1.40 MM HEIGHT, LEAD FREE, FBGA-84 |
| 文件頁數(shù)： | 13/15頁 |
| 文件大?。?/td> | 235K |
| 代理商： | S75WS256NDFBFWLK2 |
October 6, 2005 S75WS-N_02_A2
S75WS-N Based MCPs
11
P r e l i m i n a r y
5.5
Physical Dimensions – FND115 – Fine Pitch Ball Grid Array 11 x 13 mm
3524 \ 16-038.19 \ 10.5.05
PACKAGE
FND 115
JEDEC
N/A
D x E
13.00 mm x 11.00 mm
PACKAGE
SYMBOL
MIN
NOM
MAX
NOTE
A
---
---
1.40
PROFILE
A1
0.17
---
---
BALL HEIGHT
A2
0.98
---
1.15
BODY THICKNESS
D
13.00 BSC.
BODY SIZE
E
11.00 BSC.
BODY SIZE
D1
10.40 BSC.
MATRIX FOOTPRINT
E1
7.20 BSC.
MATRIX FOOTPRINT
MD
14
ME
10
MATRIX SIZE E DIRECTION
n
115
BALL COUNT
b
0.35
0.40
0.45
BALL DIAMETER
eE
0.80 BSC.
BALL PITCH
eD
0.80 BSC
BALL PITCH
SD SE
0.40 BSC.
SOLDER BALL PLACEMENT
A3-A8,B3-B8,C1,N3-N8,P3-P8
DEPOPULATED SOLDER BALLS
NOTES:
1.
DIMENSIONING AND TOLERANCING METHODS PER
ASME Y14.5M-1994.
2.
ALL DIMENSIONS ARE IN MILLIMETERS.
3.
BALL POSITION DESIGNATION PER JEP95, SECTION
4.3, SPP-010.
4.
e REPRESENTS THE SOLDER BALL GRID PITCH.
5.
SYMBOL "MD" IS THE BALL MATRIX SIZE IN THE "D"
DIRECTION.
SYMBOL "ME" IS THE BALL MATRIX SIZE IN THE "E"
DIRECTION.
n IS THE NUMBER OF POPULTED SOLDER BALL
POSITIONS FOR MATRIX SIZE MD X ME.
6
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
7
SD AND SE ARE MEASURED WITH RESPECT TO
DATUMS A AND B AND DEFINE THE POSITION OF THE
CENTER SOLDER BALL IN THE OUTER ROW.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS
IN THE OUTER ROW SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS
IN THE OUTER ROW, SD OR SE = e/2
8.
"+" INDICATES THE THEORETICAL CENTER OF
DEPOPULATED BALLS.
9.
A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER
OR INK MARK, METALLIZED MARK INDENTATION OR
OTHER MEANS.
0.08
C
C
SIDE VIEW
6
115X
A1
0.15
0.08
M C
M C
A B
b
7
SE
E1
D1
eD
10
9
8
7
6
5
4
3
2
1
eE
PIN A1
CORNER
A
D
C
E
F
G
H
J
K
7
L
M
P
N
0.20
C
BOTTOM VIEW
SD
B
A
D
E
C
0.15
(2X)
B
0.15
(2X)
TOP VIEW
9
CORNER
PIN A1
A2
A
INDEX MARK
C
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