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參數(shù)資料
| 型號： | S75WS256NDFBAWLK3 |
| 廠商： | SPANSION LLC |
| 元件分類： | 存儲器 |
| 英文描述： | Stacked Multi-Chip Product (MCP) |
| 中文描述： | SPECIALTY MEMORY CIRCUIT, PBGA84 |
| 封裝： | 9 X 12 MM, 1.40 MM HEIGHT, FBGA-84 |
| 文件頁數(shù)： | 5/15頁 |
| 文件大?。?/td> | 235K |
| 代理商： | S75WS256NDFBAWLK3 |
October 6, 2005 S75WS-N_02_A2
S75WS-N Based MCPs
3
P r e l i m i n a r y
1
Product Selector Guide
b
Note:
0 (Protected), 1 (Unprotected [Default State])
1.1
NOR Flash + pSRAM + ORNAND Flash MCPs
Device
Model
Numbers
MCP Configuration
Code
Density
(Mb)
RAM
Density
(Mb)
Data Flash
Density
(Mb)
Flash
Speed
(MHz)
pSRAM
Speed
(MHz)
DYB
Power-Up
State
(
See Note
)
pSRAM
(RAM Type 4)
Supplier
Package
84 ball
FBGA
(mm)
Code
Flash
RAM
(Mb)
Data Storage
Flash
S75WS256NDF
LK
WS256N
128
2xWS256N
256
128
512
54
54
0
4
9x12
NK
1
LJ
66
66
0
NJ
1
LH
80
80
0
NH
1
Device
Model
Numbers
NOR Flash
Density
ORNAND Flash
Density
pSRAM
Density
MCP Speed
Supplier
ORNAND Bus
Width
Package
S75WS256NEG
UK
512 Mb
1024 Mb
256 Mb
54 MHz
1.8 V
pSRAM
Type 4
x16
11 x 13 x 1.4 mm
UJ
66 MHz
UH
80 MHz
SK
54 MHz
x8
SJ
66 MHz
SH
80 MHz
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| S75WS256NDFBAWNK0 | Stacked Multi-Chip Product (MCP) |
| S75WS256NDFBAWNK2 | Stacked Multi-Chip Product (MCP) |
| S75WS256NDFBAWNK3 | Stacked Multi-Chip Product (MCP) |
| S75WS256NDFBAWSK0 | Stacked Multi-Chip Product (MCP) |
| S75WS256NDFBAWSK2 | Stacked Multi-Chip Product (MCP) |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| S75WS256NDFBAWMA | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
| S75WS256NDFBAWMB | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
| S75WS256NDFBAWNH0 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
| S75WS256NDFBAWNH2 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
| S75WS256NDFBAWNH3 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
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