型號: | S75WS256NDFBAWNK3 |
廠商: | SPANSION LLC |
元件分類: | 存儲器 |
英文描述: | Stacked Multi-Chip Product (MCP) |
中文描述: | SPECIALTY MEMORY CIRCUIT, PBGA84 |
封裝: | 9 X 12 MM, 1.40 MM HEIGHT, FBGA-84 |
文件頁數(shù): | 1/15頁 |
文件大?。?/td> | 235K |
代理商: | S75WS256NDFBAWNK3 |
相關(guān)PDF資料 |
PDF描述 |
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S75WS256NDFBAWSK0 | Stacked Multi-Chip Product (MCP) |
S75WS256NDFBAWSK2 | Stacked Multi-Chip Product (MCP) |
S75WS256NDFBAWSK3 | Stacked Multi-Chip Product (MCP) |
S75WS256NDFBAWUK0 | Stacked Multi-Chip Product (MCP) |
S75WS256NDFBAWUK2 | Stacked Multi-Chip Product (MCP) |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
---|---|
S75WS256NDFBAWPA | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
S75WS256NDFBAWPB | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
S75WS256NDFBAWSH0 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
S75WS256NDFBAWSH2 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
S75WS256NDFBAWSH3 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |