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參數(shù)資料
| 型號： | S75PL256NDFJFWGZ0 |
| 廠商： | Spansion Inc. |
| 英文描述： | Stacked Multi-Chip Product (MCP) |
| 中文描述： | 堆疊式多芯片產(chǎn)品（MCP） |
| 文件頁數(shù)： | 6/8頁 |
| 文件大?。?/td> | 177K |
| 代理商： | S75PL256NDFJFWGZ0 |
4
S75PL-N MirrorBit
ORNAND
MCPs
S75PL-N_00
_
01E April 21, 2006
D a t a
S h e e t
( A d v a n c e
I n f o r m a t i o n )
3.
Connection Diagrams
3.1
S75PL-N Pinout
Figure 3.1
107-ball Fine-Pitch Ball Grid Array (S75PL127NBF)
Note:
Top view—balls facing down. The addresses that are shared vary by MCP combination as shown in the table below:
Special Handling Instructions for FBGA Package
Special handling is required for Flash Memory products in FBGA packages.
Flash memory devices in FBGA packages may be damaged if exposed to ultrasonic cleaning methods. The
package and/or data integrity may be compromised if the package body is exposed to temperatures above
150°C for prolonged periods of time.
PL-N Addresses
PL-N/pSRAM Addresses
S75PL127NBF
A22-A21
A20:A0
3
2
9
10
5
4
7
6
8
1
B
D
E
F
G
H
J
K
L
M
N
P
A
C
DNU
DNU
DNU
DNU
VSS
RFU
RFU
RFU
RFU
RFU
RFU
RFU
RFU
Index
No ball
A7
RFU
RFU
RFU
WP#/
ACC
LB#
A8
WE#
A11
N-RY/BY
A6
A3
A15
RFU
RST#
UB#
A19
R-CE2
A12
N-RE#
A5
A2
A21
RFU
RY/BY#
A18
A9
A20
A13
N-CE#
A4
A1
A22
VCCn
RFU
A17
A10
RFU
A14
N-VCC
VSS
A0
A16
VSSn
RFU
DQ1
DQ6
RFU
RFU
N-VSS
OE#
F-CE#
RFU
I/O7
DQ3
DQ9
DQ13
DQ4
DQ15
N-CLE
DQ0
R-CE1#
VSS
I/O6
F-VCC
DQ10
DQ12
R-VCC
DQ7
N-ALE
DQ8
N-WP#
I/O4
I/O5
DQ11
DQ2
DQ5
RFU
DQ14
N-WE#
RFU
RFU
I/O3
N-PRE
RFU
VSS
I/O1
I/O0
I/O2
DNU
DNU
DNU
DNU
DNU
Legend
DNU
pSRAM Only
Reserved for Future Use
NOR Flash Only
ORNAND Flash Only
相關PDF資料 |
PDF描述 |
|---|---|
| S75PL256NDFJFWGZ2 | Stacked Multi-Chip Product (MCP) |
| S75PL256NDFJFWGZ3 | Stacked Multi-Chip Product (MCP) |
| S75PL256NDGJAWGZ0 | Stacked Multi-Chip Product (MCP) |
| S75PL256NDGJAWGZ2 | Stacked Multi-Chip Product (MCP) |
| S75PL256NDGJAWGZ3 | Stacked Multi-Chip Product (MCP) |
相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| S75PL256NDFJFWGZ2 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
| S75PL256NDFJFWGZ3 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
| S75PL256NDGJAWGZ0 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
| S75PL256NDGJAWGZ2 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
| S75PL256NDGJAWGZ3 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
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