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參數(shù)資料
| 型號： | S75PL256NDFJFWGZ0 |
| 廠商： | Spansion Inc. |
| 英文描述： | Stacked Multi-Chip Product (MCP) |
| 中文描述： | 堆疊式多芯片產(chǎn)品（MCP） |
| 文件頁數(shù)： | 3/8頁 |
| 文件大?。?/td> | 177K |
| 代理商： | S75PL256NDFJFWGZ0 |
This document contains information on one or more products under development at Spansion LLC. The information is intended to help you evaluate this product. Do not design
in this product without contacting the factory. Spansion LLC reserves the right to change or discontinue work on this proposed product without notice.
Publication Number
S75PL-N_00
Revision 01E
Issue Date
April 21, 2006
Features
Speed
– PL-N: 70 ns (initial access, 30 ns page access)
– ML-P: 30 ns (page access)
– pSRAM: 70 ns
107-Ball Fine-Pitch Ball Grid Array (FBGA)
– 9 x 12 x 1.4mm for ML512P based MCP's
– 11 x 13 x 1.4mm for ML01GP based MCPs
Operating Temperature Range
– Temperature Range of –25°C to +85°C
General Description
This document contains information for the S75PL-N MirrorBit MCP product. TheS75PL-N product consists of the following
devices:
S29PL-N
S30ML-P
3 V pSRAM
Flash/RAM Combinations Table
Product Selector Guide
For detailed specifications, please refer to the individual data sheets:
S75PL-N MirrorBit
ORNAND
MCPs
Stacked Multi-Chip Product (MCP)
S29PL-N: CMOS 3.0 Volt-only Simultaneous Read/Write,
Page-mode Flash Memory (NOR Interface)
S30ML-P: ORNAND Flash (NAND interface)
3V pSRAM
Data Sheet
(Advance Information)
S29PL127N +
pSRAM Density
32 Mb
64 Mb
S30ML512P
S75PL127NBF
S30ML01GP
Device
pSRAM Density
pSRAM Type
S75PL127NBF
32 Mb
pSRAM Type 7
Document
Publication Identification Number (PID)
S29PL-N
S29PL-N_M0
S30ML-P
S30ML-GP_00
32M pSRAM Type 7
pSRAM_29
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| S75PL256NDFJFWGZ2 | Stacked Multi-Chip Product (MCP) |
| S75PL256NDFJFWGZ3 | Stacked Multi-Chip Product (MCP) |
| S75PL256NDGJAWGZ0 | Stacked Multi-Chip Product (MCP) |
| S75PL256NDGJAWGZ2 | Stacked Multi-Chip Product (MCP) |
| S75PL256NDGJAWGZ3 | Stacked Multi-Chip Product (MCP) |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| S75PL256NDFJFWGZ2 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
| S75PL256NDFJFWGZ3 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
| S75PL256NDGJAWGZ0 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
| S75PL256NDGJAWGZ2 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
| S75PL256NDGJAWGZ3 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
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