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參數(shù)資料
| 型號： | S75PL127NDFJFWGZ2 |
| 廠商： | Spansion Inc. |
| 英文描述： | Stacked Multi-Chip Product (MCP) |
| 中文描述： | 堆疊式多芯片產(chǎn)品（MCP） |
| 文件頁數(shù)： | 7/8頁 |
| 文件大小： | 177K |
| 代理商： | S75PL127NDFJFWGZ2 |
S75PL-N_00
_
01E April 21, 2006
S75PL-N MirrorBit
ORNAND
MCPs
5
D a t a
S h e e t
( A d v a n c e
I n f o r m a t i o n )
3.2
FMH107—107-Ball Fine Pitch Ball Grid Array (FBGA) 9 x 12 mm package
Figure 3.2
FMH107
3512 \ 16-038.19 \ 8.9.05
PACKAGE
FMH 107
JEDEC
N/A
D x E
12.00 mm x 9.00 mm
PACKAGE
SYMBOL
MIN
NOM
MAX
NOTE
A
---
---
1.40
PROFILE
A1
0.17
---
---
BALL HEIGHT
A2
0.94
---
1.11
BODY THICKNESS
D
12.00 BSC.
BODY SIZE
E
9.00 BSC.
BODY SIZE
D1
8.80 BSC.
MATRIX FOOTPRINT
E1
7.20 BSC.
MATRIX FOOTPRINT
MD
12
MATRIX SIZE D DIRECTION
ME
10
MATRIX SIZE E DIRECTION
n
107
BALL COUNT
b
0.35
0.40
0.45
BALL DIAMETER
eE
0.80 BSC.
BALL PITCH
eD
0.80 BSC.
BALL PITCH
SD / SE
0.40 BSC.
SOLDER BALL PLACEMENT
A3,A4,A5,A6,A7,A8,
B1,M3,M4,M5,M6,M7,M8
DEPOPULATED SOLDER BALLS
NOTES:
1.
DIMENSIONING AND TOLERANCING METHODS PER
ASME Y14.5M-1994.
2.
ALL DIMENSIONS ARE IN MILLIMETERS.
3.
BALL POSITION DESIGNATION PER JEP95, SECTION
4.
e REPRESENTS THE SOLDER BALL GRID PITCH.
5.
SYMBOL "MD" IS THE BALL MATRIX SIZE IN THE "D"
DIRECTION.
SYMBOL "ME" IS THE BALL MATRIX SIZE IN THE "E"
DIRECTION.
n IS THE NUMBER OF POPULTED SOLDER BALL
POSITIONS FOR MATRIX SIZE MD X ME.
6
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
7
SD AND SE ARE MEASURED WITH RESPECT TO
DATUMS A AND B AND DEFINE THE POSITION OF THE
CENTER SOLDER BALL IN THE OUTER ROW.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS
IN THE OUTER ROW SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS
IN THE OUTER ROW, SD OR SE = e/2
8.
"+" INDICATES THE THEORETICAL CENTER OF
DEPOPULATED BALLS.
9.
A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER
OR INK MARK, METALLIZED MARK INDENTATION OR
OTHER MEANS.
SIDE VIEW
6
107X
0.15
0.08
M C
M C
A B
b
7
SE
E1
D1
eD
10
9
8
7
6
5
4
2
1
3
eE
PIN A1
CORNER
K
M L
7
SD
BOTTOM VIEW
C
C
B
J
H G
F
E
C
D
A
A
D
E
C
0.15
(2X)
B
C
0.15
(2X)
C
9
TOP VIEW
PIN A1
CORNER
A1
A2
A
INDEX MARK
0.08
0.20
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| S75PL127NDFJFWGZ3 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
| S75PL127NDGJAWGZ0 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
| S75PL127NDGJAWGZ2 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
| S75PL127NDGJAWGZ3 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
| S75PL127NDGJFWGZ0 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
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