參數(shù)資料
型號(hào): S75PL127NDFJFWGZ2
廠商: Spansion Inc.
英文描述: Stacked Multi-Chip Product (MCP)
中文描述: 堆疊式多芯片產(chǎn)品(MCP)
文件頁(yè)數(shù): 4/8頁(yè)
文件大小: 177K
代理商: S75PL127NDFJFWGZ2
2
S75PL-N MirrorBit
ORNAND
MCPs
S75PL-N_00
_
01E April 21, 2006
D a t a
S h e e t
( A d v a n c e
I n f o r m a t i o n )
1.
Ordering Information
The ordering part number is formed by a valid combination of the following:
S75PL
127
N
B
F
JF
W
GZ
0
PACKING TYPE
0 = Tray
2 = 7” Tape and Reel
3 = 13” Tape and Reel
MODEL NUMBER
Refer to the Valid Combinations table below
TEMPERATURE RANGE
W = Wireless (–25°C to +85°C)
PACKAGE TYPE AND MATERIAL
JA = MCP BGA, 1.4 mm height, 0.8 mm pitch, Lead (Pb)-free Compliant package
JF = MCP BGA, 1.4 mm height, 0.8 mm pitch, Lead (Pb)-free package
ORNAND DATA DENSITY
F = S30ML512P
G = S30ML01GP
pSRAM DENSITY
B = 32 Mb pSRAM
C = 64 Mb pSRAM
D = 128 Mb pSRAM
PROCESS TECHNOLOGY
N = 110 nm MirrorBit Technology
FLASH DENSITY
256 = 256 Mb
127 = 128 Mb (Single CE#)
DEVICE FAMILY
S75PL = 3.0 Volt-only Simultaneous Read/Write, Page Mode Flash Memory with Data storage
ORNAND and pSRAM
相關(guān)PDF資料
PDF描述
S75PL127NDFJFWGZ3 Stacked Multi-Chip Product (MCP)
S75PL127NDGJAWGZ0 Stacked Multi-Chip Product (MCP)
S75PL127NDGJAWGZ2 Stacked Multi-Chip Product (MCP)
S75PL127NDGJAWGZ3 Stacked Multi-Chip Product (MCP)
S75PL127NDGJFWGZ0 Stacked Multi-Chip Product (MCP)
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
S75PL127NDFJFWGZ3 制造商:SPANSION 制造商全稱(chēng):SPANSION 功能描述:Stacked Multi-Chip Product (MCP)
S75PL127NDGJAWGZ0 制造商:SPANSION 制造商全稱(chēng):SPANSION 功能描述:Stacked Multi-Chip Product (MCP)
S75PL127NDGJAWGZ2 制造商:SPANSION 制造商全稱(chēng):SPANSION 功能描述:Stacked Multi-Chip Product (MCP)
S75PL127NDGJAWGZ3 制造商:SPANSION 制造商全稱(chēng):SPANSION 功能描述:Stacked Multi-Chip Product (MCP)
S75PL127NDGJFWGZ0 制造商:SPANSION 制造商全稱(chēng):SPANSION 功能描述:Stacked Multi-Chip Product (MCP)