型號(hào): | S73WS256ND0BFWA70 |
廠商: | SPANSION LLC |
元件分類(lèi): | 存儲(chǔ)器 |
英文描述: | Stacked Multi-Chip Product (MCP) |
中文描述: | SPECIALTY MEMORY CIRCUIT, PBGA137 |
封裝: | 9 X 12 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-137 |
文件頁(yè)數(shù): | 1/251頁(yè) |
文件大小: | 3747K |
代理商: | S73WS256ND0BFWA70 |
相關(guān)PDF資料 |
PDF描述 |
---|---|
S73WS256ND0BFWA72 | Stacked Multi-Chip Product (MCP) |
S73WS256ND0BFWA73 | Stacked Multi-Chip Product (MCP) |
S73WS256ND0BFWAB0 | Stacked Multi-Chip Product (MCP) |
S73WS256ND0BFWAB2 | Stacked Multi-Chip Product (MCP) |
S73WS256ND0BFWAB3 | Stacked Multi-Chip Product (MCP) |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
---|---|
S73WS256ND0BFWA72 | 制造商:SPANSION 制造商全稱(chēng):SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
S73WS256ND0BFWA73 | 制造商:SPANSION 制造商全稱(chēng):SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
S73WS256ND0BFWAB0 | 制造商:SPANSION 制造商全稱(chēng):SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
S73WS256ND0BFWAB2 | 制造商:SPANSION 制造商全稱(chēng):SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
S73WS256ND0BFWAB3 | 制造商:SPANSION 制造商全稱(chēng):SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |